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Curable resin composition, overcoats, and process for formation thereof

A technology of curable resin and composition, which can be used in electric solid devices, semiconductor/solid device parts, instruments, etc., and can solve problems such as poor display, contamination of panel substrates, difficult baking conditions, etc.

Inactive Publication Date: 2009-07-01
JSR CORPORATIOON +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In addition, with the increase in the size of panel substrates in recent years, when a thermosetting composition is used for the formation of a protective film, a very small amount of unreacted monomers remaining will sublimate and accumulate inside the baking furnace, contaminating the baking furnace, making it difficult to process. The control of baking conditions, or the accumulation of unreacted monomers and / or their thermal products adhere to and contaminate the panel substrate, causing poor display problems.
[0010] When forming a protective film for a color filter, it is preferable to use a curable resin composition that has the advantage of being able to easily form a protective film with excellent surface hardness. Such a material that can form a protective film that satisfies various requirements as described above and that has excellent storage stability of the composition has not yet been known.

Method used

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  • Curable resin composition, overcoats, and process for formation thereof
  • Curable resin composition, overcoats, and process for formation thereof
  • Curable resin composition, overcoats, and process for formation thereof

Examples

Experimental program
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Embodiment approach -

[0254] When the preferable embodiment of each curable resin composition of this invention is shown more concretely, there are following (I)-(IV).

[0255] (1) One-component curable resin composition (α) containing polymer (A) (preferably at least one of copolymer (A1), copolymer (A2) and copolymer (A3) A) and (B) the cationic polymerizable compound, depending on the situation, also contain the following optional additive components, relative to 100 parts by weight of the polymer (A), the amount of the cationic polymerizable compound is 3-100 parts by weight, more preferably 5-50 parts by weight.

[0256] In this one-component curable resin composition (α), a protective film having sufficient surface hardness can be obtained by making the usage-amount of the cationically polymerizable compound within the above-mentioned range. The one-component curable resin composition (α) is particularly excellent in long-term storage stability.

[0257] (II) A one-component curable resin c...

Embodiment

[0306] Synthesis examples and examples are given below to further describe the present invention in detail, but the present invention is not limited to the following examples.

[0307]

[0308] Device: GPC-101 (manufactured by Showa Denko Co., Ltd.)

[0309] Column: Combine GPC-KF-801, GPC-KF-802, GPC-KF-803 and GPC-KF-804

[0310] Mobile phase: tetrahydrofuran containing 0.5 wt% phosphoric acid.

[0311] Synthesis of Copolymer (A)

Synthetic example 1

[0313] Add 1 part by weight of azobisisobutyronitrile, 4 parts by weight of cumyl dithiobenzoate and 50 parts by weight of diethylene glycol ethyl methyl ether in the flask equipped with condenser tube and stirrer. Then add 80 parts by weight Parts of glycidyl methacrylate and 20 parts by weight of styrene, after replacing with nitrogen, stir slowly. Raise the temperature of the reaction solution to 60°C, keep the temperature for 24 hours, and then add 3 parts by weight of azobisisobutyronitrile , then stirred at 60°C for 4 hours, and added 200 parts by weight of diethylene glycol ethyl methyl ether to obtain a solution of the copolymer (A-1). The polystyrene-equivalent weight-average molecular weight (Mw) of the copolymer (A-1) ) was 10,000, the molecular weight distribution (Mw / Mn) was 1.3, and the residual monomer was 1.7% by weight. The solid concentration of the polymer solution was 29.7% by weight.

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Abstract

A curable resin composition capable of forming an overcoat for optical devices efficient in smoothening the uneven surface of a color filter formed on a substrate, which satisfies the requirements of transparency, heat resistance, surface hardness, and tight adhesion and which exhibits excellent load resistance even under heating and little produces sublimates in baking. A curable resin composition comprising (A) and (B), wherein (A) having two or more epoxy groups and an Mw / Mn ratio of 1.7 or below wherein Mw and Mn are a weight-average molecular weight and a number-average molecular weight, respectively, as determined by gel permeation chromatography in terms of polystyrene, and (B) a cationic polymerizable compound different from the component (A). Overcoats made from the composition and a process for formation of the overcoats are also provided.

Description

technical field [0001] The present invention relates to a curable resin composition, and particularly to a curable resin composition suitable as a protective film forming material used in optical devices such as liquid crystal display elements (LCD) or charge-coupled devices (CCD) or CMOS sensors. A protective film formed from the composition and a method for forming the protective film. Background technique [0002] In the steps of manufacturing optical devices such as LCDs or CCDs, the display elements are treated by immersion in solvents, acids, or alkalis. In addition, when the wiring electrode layer is formed by sputtering, the surface of the element is locally exposed to high temperature. Therefore, in order to prevent Since the display element is deteriorated or damaged by the above-mentioned treatment, a protective film resistant to the above-mentioned treatment has been provided on the surface of the display element. [0003] The protective film is required to have...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/20H01L23/29H01L23/31G03F7/00G03F7/038
CPCH01L2924/0002G03F7/038G03F7/0007H01L23/293H01L2924/00C08G59/20C08G59/24C08J5/22
Inventor 梶田彻马场厚志保浩司
Owner JSR CORPORATIOON
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