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Chemical plating method for Mg and its alloy

A technology of electroless plating and electroless nickel plating solution, which is applied in the field of bottom nickel, and can solve the problems of buried magnesium or its alloys such as hand feeling, texture, limitation, and dull color

Inactive Publication Date: 2009-02-18
李克清
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current surface treatment of magnesium or its alloys is mostly limited to the spraying technology on the surface of the product, such as plasma spraying, painting, plastic spraying, ceramic spraying, etc.
The disadvantage of this type of surface treatment is that if the product is used as a functional part, it loses the original properties of the metal, such as the unique properties of electricity, heat conduction, welding, and magnetism; The color is dull, which not only hides the excellent feel and texture of magnesium or its alloys, but also cannot match the color of the current parts made of ABS plastic, zinc alloy, copper, iron, etc. after water electroplating

Method used

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  • Chemical plating method for Mg and its alloy

Examples

Experimental program
Comparison scheme
Effect test

preparation Embodiment A

[0055] Preparation Example A Preparation of activation treatment solution (A-1, A-2)

[0056] 1. The composition of PIN-1 additive is

[0057] Composition of PIN-1 Hexamethylenetetramine phosphoric acid volume% 100 300

[0058] Dissolve 300ml of phosphoric acid and 100ml of hexamethylenetetramine in 300ml of pure water to obtain a 2-fold concentrate of the PIN-1 additive.

[0059] 2. The composition of PIN-2 additive is

[0060] Composition of PIN-2 Hexamethylenetetramine Sodium citrate Weight g / L 100 120

[0061] Weigh the above grams and dissolve in 1 liter of pure water to obtain a 4-fold concentrate of the PIN-2 additive.

[0062] Preparation of 3.1 liters of activation treatment solution:

[0063] Weigh 100 grams of ammonium bifluoride, dissolve in 200ml of pure water, stir to dissolve, add 500ml of 2 times concentrated solution of PIN-1 additive, make up to 1000ml of pure water to obtain activation treatment solution...

preparation Embodiment B

[0066] Preparation Example B Preparation of neutralization treatment solution B-1

[0067] 1. The composition of PIN-3 additive is

[0068] Composition of PIN-3 sodium hypophosphite ammonium bifluoride Sodium citrate Weight g / L 200 40 120

[0069] Weigh the above grams and dissolve in 1 liter of pure water to obtain a 4-fold concentrate of the PIN-3 additive.

[0070] 2. PIN-4 additive

[0071] Weigh 40 grams of gelatin, place in 50-60°C hot water, stir until dissolved, and boil to obtain a 4-fold concentrate of the PIN-4 additive.

[0072] 3. Preparation of neutralization treatment solution:

[0073] Weigh 80g of potassium pyrophosphate and dissolve it in 200ml of pure water. After stirring to dissolve, add 250ml of PIN-3 additive and PIN-4 additive 4 times concentrated solution respectively, and make up to 1000ml of pure water to obtain neutralization treatment solution B-1.

preparation Embodiment C

[0074] Preparation Example C Preparation of pre-electroless nickel plating solution

[0075] 1. Pre-electroless nickel plating bath SAU-1 additive

[0076] Composition of SAU-1 buffer buffer complexing agent D Element sodium acetate sodium bicitrate lactic acid lauryl sulfate Weight g / L 40 60 40ml / L 20

[0077] Weigh the above grams and volume, dissolve in 1 liter of pure water to obtain a 4-fold concentrate of the SAU-1 additive.

[0078] 2. Pre-electroless nickel plating bath SAU-2 additive

[0079] Composition of SAU-2 catalyst catalyst Element sodium glutamate neodymium Weight g / L 12 1

[0080] Weigh the above grams and dissolve in 1 liter of pure water to obtain a 10-fold concentrate of SAU-2 additive.

[0081] 2. Pre-electroless nickel plating bath SAU-3 additive

[0082] Composition of SAU-3 stabilizer Element potassium iodate Weight g / L 0.1

[0083] Weigh...

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Abstract

The chemical plating process for magnesium-base material includes the following steps: 1. alkaline dewaxing the magnesium-base material; 2. activating with acid solution containing fluoric salt and no chlorine ion and in pH 2.0-5.0, and treating with alkaline neutralizing solution containing alkali metal salt of pyrophosphoric acid, fluoric salt and hypophosphite in pH 8.0-12.0; 3. chemical nickel pre-plating with the plating solution containing nickel salt in 10-80 g / L concentration, fluoric salt in 5-50 g / L concentration, pyrophosphite in 20-100 g / L concentration and no chlorine ion and in pH 5.0-9.0; 4. chemical nickel plating with the plating solution containing nickel salt in 10-100 g / L concentration, pyrophosphite in 10-80 g / L concentration and no chlorine ion and in pH 3-7; and 5. optional heat treatment. The said process can form homogeneous compact nickel layer with sufficient binding force on magnesium-base material.

Description

field of invention [0001] The invention relates to an electroless plating process for magnesium or its alloys. Specifically, the present invention relates to covering the substrate of chemically active magnesium or its alloys with sufficient binding force, uniform and dense underlying nickel through an electroless plating process. Background technique [0002] Magnesium is a light metal and has a large reserve in the earth's metals. At present, magnesium is becoming the third largest metal engineering material after steel and aluminum. It has excellent physical properties in terms of strength, toughness, light weight, electrical conductivity, etc. However, due to the active chemical properties of magnesium, it is easy to be corroded, so its use has been limited for a long time. In recent years, with the breakthrough of magnesium smelting and molding technology, the application of magnesium has developed greatly. Magnesium and its alloys, which have good damping and shock...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/36
Inventor 李克清
Owner 李克清
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