Non-conducting adhesion material composition

Abstract

The invention relates to a non-conducting focal adhesion material, comprising following components: (a) at least one epoxy resin of non siloxane epoxy resin, and the epoxy equivalent weight is larger than 150 g / e and smaller than 3000 g / e; (b) siloxane epoxy resin, with the content being 10- 30 wt% of that of (a), and the epoxy equivalent weight is between 250- 1500 g / e; (c) imidazole or sclerosing agent of its derivative, with its content being 5- 15 wt% of the total weight of (a) and (b); (d) phenol compound catalyst, with the content being 1- 8 wt% of that of (a) and (b); (e) toughening agent, with the content being 5- 16 wt% of that of (a) and (b); and (f) organic solvent, with the content being 25- 55 wt5 of the total weight of (a) (b) (c) (d) and (e).

Description

technical field [0001] The present invention relates to a composition, and in particular to a non-conductive adhesive material composition. Background technique [0002] With the advent of the digital age and the popularization of the Internet, the application field of flat-panel displays has moved from portable small and medium-sized products to large-scale panels for information and even extended to super-large video applications, making flat-panel displays officially enter a full range of applications. . In addition to the LCD panel, the liquid crystal display must be connected with a driver chip around it for the purpose of controlling the display signal. The main function of the driver IC is to output the required voltage to the pixels to control the twisting degree of the liquid crystal molecules. The source driver circuit (IC) is to process the input of data and the gate driver IC is to control the twisting amplitude and speed of the liquid crystal molecules. The fl...

AI Technical Summary

Problems solved by technology

[0006] In order to improve this problem, quite a lot of anisotropic conductive adhesive technologies have been proposed, such as US Patent No. 5120665, which uses small-sized insulating powder on the surface of the conductive powder to block the contact between the conductive powder and improve the material. Electrical anisotropy; U.S. Patent No. 6110399 uses the principle of magnetic conductive powder homosexual repulsion to reduce the short-circuit probability of anisotropic amber film when used; U.S. Patent No. 6020059 is made of insulating layer and conductive layer Two-layer or three-layer thin-film structure is used to improve the anisotropic conductive characteristics of the anisotropic conductive adhesive film in flip-chip structures with higher pin counts, but it still cannot meet the internal connectivity requirements of flip-chip structures with higher pin counts.

Taking grain glass bonding structure (COG structure) as an example, the use of commercially available anisotropic conductive adhesive products is limited to about 38 μm in line spacing. In higher density COG structures, the conductive powder between the bumps will Insufficient quantity leads to electrical failure problems

[0007] (2) Stress causes structural delamination

However, the existing anisotropic conductive film material technology still has the problems of high processing temperature and water absorption, which need to be improved.

[0009] (3) High cost of anisotropic conductive film products

[0010] Since the anisotropic conductive film material requires special treatment of conductive powder, dispersion and processing technology, the cost of its products remains high, which conflicts with the current development trend of multi-functional and low-priced consumer electronics products, resulting in to affect the growth rate of the overall market

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