Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

113 results about "Posterior approach" patented technology

In the posterior approach, an incision is made beside or behind your hip joint. Your surgeon goes through muscle and detaches some of the muscles from the “ball and socket” of the hip joint. Next, your surgeon smoothes out the hip socket and removes cartilage and any debris such as damage to the bone from osteoarthritis.

Artificial Disc Replacement Using Posterior Approach

Methods and devices are provided for replacing a spinal disc. In an exemplary embodiment, artificial disc replacements and methods are provided wherein at least a portion of a disc replacement can be implanted using a posterolateral approach. With a posterolateral approach, the spine is accessed more from the side of the spinal canal through an incision formed in the patient's back. A pathway is created from the incision to the disc space between adjacent vertebrae. Portions of the posterolateral annulus, and posterior lip of the vertebral body may be removed to access the disc space, leaving the remaining annulus and the anterior and posterior longitudinal ligaments in tact. The disc implant can be at least partially introduced using a posterolateral approach, yet it has a size that is sufficient to restore height to the adjacent vertebrae, and that is sufficient to maximize contact with the endplates of the adjacent vertebrae.
Owner:DEPUY SPINE INC (US)

Posterior Prosthetic Intervertebral Disc

A prosthetic intervertebral disc is formed of first and second end plates sized and shaped to fit within an intervertebral space and to be implanted from the back of the patient, thereby decreasing the invasiveness of the procedure. The posterior approach provides for a smaller posterior surgical incision and avoids important blood vessels located anterior to the spine particularly for lumbar disc replacements. The first and second plates are each formed of first, second and third parts are arranged in a first configuration in which the parts are axially aligned to form a low profile device appropriate for insertion through the small opening available in the TLIF or PLIF approaches described above. The three parts of both of the plates rotate and translate with respect to one another in situ to a second configuration or a deployed configuration in which the parts are axially unaligned with each other to provide a maximum coverage of the vertebral end plates for a minimum of insertion profile. Upon deployment of the disc, a height of the disc is increased.
Owner:SIMPLIFY MEDICAL PTY LTD

Surgical positioning assembly and associated spinal implant device and surgical methods

The present invention provides a surgical positioning assembly that is used to place a spinal implant device or the like within an intervertebral space or the like of a patient and associated surgical methods. Advantageously, the surgical positioning assembly allows access to the implantation site to be gained along a first axis, with the implant device subsequently being placed along a second axis that is disposed at an angle or substantially perpendicular to the first axis via the actuation of the surgical positioning assembly. Thus, for example, a surgeon may use an anterior or posterior approach to place an implant device laterally, or vice versa.
Owner:CTL MEDICAL CORP

Method for repair of a spine and intervertebral implant

InactiveUS20070016298A1Bone implantSpinal implantsLongissimusSpinal column
Repair of a spine from a posterior approach especially for locating an implant between a lower and upper human vertebra includes making an incision in the skin lateral to the midline, making an incision through the Erector Spinae Aponeurosis (ESA) following the ELIF groove, separating the ESA from the Longissimus Thoracis Pars Lumborum (LTPL), atraumatic separating the Multifidus from the LTPL using the interfascial boundary between the Multifidus and the LTPL, and creating a surgical plane having an angle of 20°-60°.
Owner:LIGNE
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products