Contact grid array system

Abstract

A scalable, low cost, reliable, compliant, low profile, low insertion force, high-density, separable and reconnectable electrical connection for high speed, high performance electronic circuitry and semiconductors. The electrical connection can be used to make, for example, electrical connections from one Printed Circuit Board (PCB) to another PCB, MPU, NPU, or other semiconductor device.

Description

FIELD OF THE INVENTION[0001]The invention pertains to separable electronic contact systems and, more particularly, to a separable electronic contact grid array system having exceptional elasticity and low inductance properties, and which is elastically and electrically functional across the entire gap separating the electronic devices to be connected.BACKGROUND OF THE INVENTION[0002]The ability to make separable electrical contact with contacts of miniature electronic circuits has become more problematic as the mechanical, electrical, and reliability requirements of these electrical contacts become more demanding. Nano springs, pogo pins, micro springs, and other miniature contact devices have been developed to deal with the problem of making reliable electrical contact between a microcircuit and the rest of an electronic system. The problem for the industry, however, is that no particular contact design appears to provide all of the properties required, even where specially designe...

AI Technical Summary

Benefits of technology

[0040]For even higher density interconnections, additional parallel circuit elements may be stacked and electrically connected through additional BLGA connectors to create a three-dimensional package. A retentive force is not inherent, as with pin-and-socket-type interconnections, but a clamping mechanism is needed to create the force necessary to ensure each contact member is compressed an appropriate amount during engagement. This is needed to form the required interconnections to the circuit elements. Thermal management structures and other electrical circuitry may be included within the structure to enhance overall system performance.

[0041]PCB techniques are used to fabricate the contacts and substrates of this invention. Typical mechanical and electrical characteristics for the contacts of this invention include a large working range greater than 5 mils, a low contact force less than 30 g, wiping action having both horizontal and vertical components for reliability, high durability greater than two hundred thousand cycles, high temperature operability greater than 125° C., good elasticity, low inductance less than 0.5 nH, high current capacity greater than 1.5 A, a small scalable pitch less than 20 mils, and a functional elasticity across the entire gap separating the two devices, boards, or substrates to be electrically connected.

[0058]It is therefore an object of the invention to provide a scalable, low cost, reliable, compliant, low profile, low insertion force, high density, electrically optimized contact element and contact system.

Problems solved by technology

The microfabrication techniques disclosed by Khoury et al. have inherent and practical limitations with respect to the ratio of the elastic working range to the electrical contact distance, which is much less than 1.

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