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Polyphenylene ether resin composition, prepreg, metal-clad laminate

a technology of polyphenylene ether and composition, which is applied in the direction of metal layered products, electrical appliances, printed circuits, etc., can solve the problems that metal-clad laminate plates produced using conventionally known polyphenylene ether resin compositions sometimes have insufficient and achieve excellent heat resistance and water resistance.

Pending Publication Date: 2022-08-11
NIPPON SODA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a polyphenylene ether resin composition that can be used to produce a metal-clad laminate plate with excellent heat resistance and water resistance. The composition contains a polyphenylene ether that has a repeating unit of a specific formula. The polyphenylene ether can have different groups attached to it, such as hydrogen, alkyl, alkenyl, alkynyl, etc. The composition can be used to make a laminate plate that is suitable for a variety of applications.

Problems solved by technology

The metal-clad laminate plates produced using conventionally known polyphenylene ether resin compositions sometimes have insufficient heat resistance and water resistance.

Method used

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  • Polyphenylene ether resin composition, prepreg, metal-clad laminate
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  • Polyphenylene ether resin composition, prepreg, metal-clad laminate

Examples

Experimental program
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Effect test

production example 1

[0056]Into a 500 mL flask, 151.95 g of tetrahydrofuran (hereinafter, abbreviated as THF) and 19.65 g of hexane were added. After the mixture was cooled to −40° C., 2.28 g of n-butyllithium (a hexane solution with a concentration of 15.1% by weight) was added and stirred for 10 minutes, then 11.99 g of styrene was added dropwise, and the reaction was continued for 30 minutes. The solution was measured by gas chromatography (hereinafter, abbreviated as GC) and the disappearance of monomers was confirmed. Then, a mixed solution of 21.44 g of 1,3-butadiene, 23.43 g of THF, and 7.80 g of hexane was added dropwise, and the reaction was continued. After the solution was measured by GC and the disappearance of monomers was confirmed, 12.05 g of styrene was added dropwise, and after 30 minutes, 0.51 g of methanol was added to terminate the reaction.

[0057]The copolymer obtained was analyzed by gel permeation chromatography (mobile phase: THF, polystyrene standards), and it was confirmed that ...

production example 2

[0059]Into a 500 mL flask, 149.37 g of THF and 17.53 g of hexane were added. After the mixture was cooled to −40° C., 5.21 g of n-butyllithium (a hexane solution with a concentration of 15.1% by weight) was added and stirred for 10 minutes, then 10.47 g of styrene was added dropwise, and the reaction was continued for 30 minutes. The solution was measured by gas chromatography (hereinafter, abbreviated as GC) and the disappearance of monomers was confirmed. Then, a mixed solution of 49.28 g of 1,3-butadiene and 49.28 g of THF was added dropwise and the reaction was continued. After the solution was measured by GC and the disappearance of monomers was confirmed, 10.66 g of styrene was added dropwise, and after 30 minutes, 1.12 g of methanol was added to terminate the reaction.

[0060]The copolymer obtained was analyzed by gel permeation chromatography (mobile phase: THF, polystyrene standards), and it was confirmed that the molecular weight (Mw) was 14,200 and the molecular weight dist...

production example 3

[0062]Into a 500 mL flask, 155.90 g of cyclohexane and 20.10 g of THF were added. The mixture was warmed to 30° C., 1.95 g of n-butyllithium (a hexane solution with a concentration of 15.1% by weight) was added and stirred for 10 minutes, then 7.64 g of styrene was added dropwise, and the reaction was continued for 30 minutes. The solution was measured by gas chromatography (hereinafter, abbreviated as GC) and the disappearance of monomers was confirmed. Then, a mixed solution of 35.07 g of 1,3-butadiene and 35.07 g of cyclohexane was added dropwise and the reaction was continued. After the solution was measured by GC and the disappearance of monomers was confirmed, 7.78 g of styrene was added dropwise, and after 30 minutes, 0.40 g of methanol was added to terminate the reaction.

[0063]The copolymer obtained was analyzed by gel permeation chromatography (mobile phase: THF, polystyrene standards), and it was confirmed that the molecular weight (Mw) was 17,400 and the molecular weight ...

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Abstract

A polyphenylene ether resin composition includes (A) polyphenylene ether, and (B) a block copolymer including a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. The number average molecular weight (Mn) of the component (A) may be 1,000 to 7,000, the weight ratio of the styrene block to the butadiene block in the component (B) may be 10:90 to 80:20, and the weight average molecular weight (Mw) of the component (B) may be 2,000 to 100,000.

Description

TECHNICAL FIELD[0001]The present invention relates to a polyphenylene ether resin composition, a prepreg, and a metal-clad laminate plate. The present application claims priority based on Japanese Patent Application No. 2019-144191 filed on Aug. 6, 2019, and Japanese Patent Application No. 2020-031772 filed on Feb. 27, 2020, the content of which is incorporated herein by reference.BACKGROUND ART[0002]Polyphenylene ether (PPE) has excellent dielectric characteristics such as dielectric constants and dielectric loss tangent, and also has excellent dielectric characteristics in a high-frequency band (high-frequency region) from the MHz band to the GHz band. Thus, the resin composition comprising polyphenylene ether is considered for use as, for example, a molding material for high-frequency applications. When the resin composition is utilized as a molding material such as a substrate material, it is required to have not only excellent dielectric characteristics, but also excellent heat...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L53/02C08J5/24B32B15/20B32B5/02B32B15/14B32B15/12
CPCC08L71/12B32B2260/023C08J5/244B32B15/20B32B5/02B32B15/14B32B5/022B32B15/12B32B2260/021B32B2260/046B32B2307/204B32B2307/308B32B2307/306B32B2262/101B32B2262/0269B32B2262/0276B32B2260/028C08L53/02C08L71/126B32B5/26B32B29/00B32B29/005C08L2201/08C08J2371/12C08J2453/02B32B2307/7265C08F297/04C08F283/085C08F287/00C08J2353/02C08J2471/12H05K1/0326H05K1/0366C08F236/10C08F290/062C08F226/06C08L71/02C08K5/34924C08F2/06C08F4/48B32B15/08C08J5/24H05K1/0373
Inventor OSUMI, SHOTATANDO, IZUMIUEDA, HIROKIHAYAKAWA, YOSHIO
Owner NIPPON SODA CO LTD
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