Detection apparatus and method of chemical mechanical polishing conditioner

Abstract

The present invention relates to a detection apparatus of chemical mechanical polishing conditioner, comprising: a working platform with a working plane; a placement base disposed on the working plane of the working platform, for carrying a chemical mechanical polishing conditioner; an image capture device forming one or a plurality of captured images on different regions of the chemical mechanical polishing conditioner; a display device; an image recognition module, wherein the captured images are performed a color matching by the image recognition module to determine one or a plurality of risk diamonds on the chemical mechanical polishing conditioner, and the coordinate location of the risk diamonds are outputted into the display device; and a mobile platform for moving the risk diamonds to specified locations. A detection method of the above mentioned detection apparatus is also disclosed.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefits of the Taiwan Patent Application Serial Number 102116516, filed on May 9, 2013, the subject matter of which is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a detection apparatus and a method of a chemical mechanical polishing conditioner, and more particularly to a chemical mechanical polishing conditioner which may provide a detection of risk diamond on the chemical mechanical polishing conditioner.[0004]2. Description of Related Art[0005]Chemical mechanical polishing (CMP) is a common polishing process in various industries, which can be used to grind the surfaces of various articles, including ceramics, silicon, glass, quartz, or a metal chip. In addition, with the rapid development of integrated circuits, chemical mechanical polishing becomes one of the common techniques for wafer planarization due to its ability to...

AI Technical Summary

Benefits of technology

The present invention provides a detection apparatus and method for a chemical mechanical polishing conditioner to detect and remove risk diamonds that may cause scratches and breakages on the polishing pad during a chemical mechanical polishing process. The detection apparatus uses an image capture device to capture images of the conditioner and an image recognition module to identify the risk diamonds based on their color and coordinate locations. A mobile platform is then used to remove the risk diamonds to a specified location. This invention allows for the efficient detection and removal of risk diamonds, improving the quality of the chemical mechanical polishing process.

Problems solved by technology

A person wastes his energy and time on the well-known methods, and the detection results of the well-known method are still doubtful.

However, during an actual process for manufacturing the chemical mechanical polishing conditioner, a part of diamond particles include risk diamonds with twin crystal structures or internal crack structures; wherein the risk diamonds may come from the source of materials of the diamonds themselves, or the risk diamonds may come from the diamond particles in the brazing process or the conditioner in the post-processing procedure.

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