Structure and process of heat dissipation substrate

Abstract

Structure of a heat dissipation substrate including a metal substrate, a first insulating material, a second insulating material, a first patterned conductive layer and a second patterned conductive layer is provided. The metal substrate has an upper surface and a lower surface opposite to each other, a plurality of first recesses located on the upper surface and a plurality of second recesses located on the lower surface. The first insulating material is provided to fill into the first recesses. The second insulating material is provided to fill into the second recesses. The first patterned conductive layer is disposed on the upper surface of the metal substrate and a portion of the first insulating material. The second patterned conductive layer is disposed on the lower surface of the metal substrate and a portion of the second insulating material.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of Taiwan application serial no. 100129781, filed on Aug. 19, 2011. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The invention relates to a metal substrate, more particularly, the invention relates to a structure of a heat dissipation substrate adopted in a heating device and a fabricating process of the same.[0004]2. Description of Related Art[0005]With the progression in fabricating technology, light emitting diodes (LEDs) have gradually increased the light emitting efficiency through persistent research and improvement to further enhance the light emitting brightness thereof so as to satisfy demands in various products. In other words, other than improving the external packaging thereof, LEDs also require advanced design to achieve higher e...

AI Technical Summary

Benefits of technology

The invention is about a way to make a heat dissipation substrate that has a structure that helps to reduce the cost and steps involved in its production. The process involves using two insulating materials as a mask to etch the metal substrate and form individual heat dissipation substrates. This method eliminates the need for an extra layer of photoresist, which saves time and money. Overall, the invention reduces the cost and complexity of heat dissipation substrate production.

Problems solved by technology

However, when the electrical power and the working current of LEDs are increased, LEDs generate higher thermal energy which then affects the performance of LEDs or results in the malfunction of LEDs by overheat.

Since the etching process requires an additional photo-resist layer covering on the copper substrate and the copper layer of the insulating material, additional steps and fabrication cost are needed.

Moreover, when the thickness of the heat dissipation substrate is reduced in half to satisfy the trend of miniaturization in packaging technology so that the thickness of the heat dissipation substrate is decreased from 1 mm to less than 0.6 mm, the heat dissipation substrate easily bends and deforms due to insufficient flexural strength, thereby affecting the subsequent packaging process.

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