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Vapor chamber structure with improved wick and method for manufacturing the same

a vapor chamber and wick technology, applied in the direction of basic electric elements, lighting and heating apparatus, semiconductor devices, etc., can solve the problems of limited overall thermal performance of the vapor chamber, insufficient conductive heat transfer through solid materials, and a major obstacle to cooling or heat removal, etc., to achieve the effect of improving thermal performan

Inactive Publication Date: 2009-01-29
THERMAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010]One particular aspect of the present invention is to provide a vapor chamber structure and a method for manufacturing the same. The vapor chamber structure of the present invention has improved thermal performance due to the usage of at least one improved wick structure.
[0013]Therefore, the present invention can improve the thermal performance of the vapor chamber due to the use of the improved wick structures.

Problems solved by technology

Cooling or heat removal has been one of the major obstacles of the electronic industry.
However, this conductive heat transfer through solid materials is generally insufficient to meet the higher cooling requirements of newer electronic devices.
A simple wick structure is difficult to optimize for both boiling initiation and fluid flow by capillary force and thus the overall thermal performance of the vapor chamber is limited.
Furthermore the backflow efficiency (ability to return the working fluid to the evaporator portion of the vapor chamber) of the working fluid is limited.

Method used

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  • Vapor chamber structure with improved wick and method for manufacturing the same
  • Vapor chamber structure with improved wick and method for manufacturing the same
  • Vapor chamber structure with improved wick and method for manufacturing the same

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Embodiment Construction

[0078]Referring to FIGS. 2 to 5, the first embodiment of the present invention provides a vapor chamber structure 1a, comprising: a casing 10, a working fluid 20, a wick layer 12, and at least one structure strengthening bodies 13.

[0079]The casing 10 has an airtight vacuum chamber 100, and the working fluid 20 is filled into the airtight vacuum chamber 100. The casing 10 is composed of an upper casing 101 and a lower casing 102 that mates with the upper casing 101. Moreover, the casing 10 has contact surfaces between the upper casing 101 and the lower casing 102. The contact surfaces have a predetermined width, in order to assemble the upper casing 101 and the lower casing 102 easily.

[0080]Furthermore, the vapor chamber structure further comprises at least one filling pipe 15 communicated with the airtight vacuum chamber 100 via a joint opening 103 of the casing 10 (in FIG. 2, a filling pipe 15 is shown). The filling pipe 15 has an opening side 151 formed on one side thereof and a c...

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Abstract

A vapor chamber structure includes a casing, a working fluid, and an improved wick layer. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. Therefore, the present invention can increase the backflow velocity of the working fluid and improve the boiling of the working fluid due to the match of the improved wick structure. Because the backflow velocity and boiling of the working fluid is increased, the heat-transmitting efficiency is increased.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a vapor chamber structure and a method for manufacturing the same, and particularly relates to a vapor chamber structure having an improved wick and a method for manufacturing the same.[0003]2. Description of the Related Art[0004]Cooling or heat removal has been one of the major obstacles of the electronic industry. The heat dissipation increases with the scale of integration, the demand for higher performance, and the increase of multi-functional applications. The development of high performance heat transfer devices becomes one of the major development efforts of the industry.[0005]A heat sink is often used for removing the heat from the device or from the system to the ambient. The performance of a heat sink is characterized by the thermal resistance with a lower value representing a higher performance level. This thermal resistance generally consists of the heat-spreading resistance ...

Claims

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Application Information

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IPC IPC(8): F28D15/00
CPCF28D15/046H01L23/427Y10T29/49353H01L2924/0002H01L2924/00
Inventor HOFFMAN, PAULTANDON, RAJIVREMSBURG, RALPHSEMENIC, TADEJHONG, CHU-WANLEE, CHE-YIN
Owner THERMAL TECH
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