Conductive ink composition and method of forming a conductive pattern using the same

Abstract

A conductive ink composition includes about 15% to about 50% by weight of copper nanoparticles, about 40% to about 80% by weight of a non-aqueous solvent mixture, about 0.01% to about 5% by weight of a dispersion agent and about 1% to about 20% by weight of a wetting agent. A conductive pattern may be formed with use of the conductive ink composition and an inkjet printer.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims priority under 35 USC §119 to Korean Patent Application No. 2007-31284, filed on Mar. 30, 2007 in the Korean Intellectual Property Office (KIPO), the contents of which are herein incorporated by reference in their entirety.BACKGROUND OF THE INVENTION[0002]1. Technical Field[0003]The present invention relates to a conductive ink composition and a method of forming a conductive pattern using the conductive ink composition.[0004]2. Discussion of the Related Art[0005]An optical patterning method using a photolithography process is used for forming a conductive pattern. However, the optical patterning method using the photolithography process requires many processing steps and is complicated, so that the manufacturing costs for forming the conductive pattern are increased. Types of substrates usable in the optical patterning method may be limited due to an exposure process and a development process. Furthermore, environm...

AI Technical Summary

Benefits of technology

The present invention provides a conductive ink composition that can reduce manufacturing costs and improve the oxidation stability of a conductive pattern. The conductive ink composition includes copper nanoparticles, a non-aqueous solvent mixture, a dispersion agent, and a wetting agent. The non-aqueous solvent mixture includes a first solvent, a second solvent, and a third solvent. The copper nanoparticles have an average diameter of about 1 nm to about 100 nm and a skin layer including a capping polymer. The conductive ink composition has a viscosity of about 0.5 mPa·s to about 40 mPa·s at about 25°C and a surface tension of about 20 mN / m to about 70 mN / m at about 25°C. The conductive ink composition can be sprayed onto a substrate and heated to form a conductive pattern. The use of an inkjet printer and a non-aqueous solvent mixture can facilitate the formation of conductive patterns with reduced manufacturing costs and improved oxidation stability.

Problems solved by technology

However, the optical patterning method using the photolithography process requires many processing steps and is complicated, so that the manufacturing costs for forming the conductive pattern are increased.

Types of substrates usable in the optical patterning method may be limited due to an exposure process and a development process.

Furthermore, environmental pollution may be caused by gas and wastewater generated in the exposure process and the development process.

Furthermore, the inkjet printing method does not include an exposure process and an etching process that does not generate environmental pollutants.

However, the molten metal has a high temperature, and thus the molten metal is difficult to apply to actual inkjet printing processes.

However, the ink containing the copper nanoparticles has relatively low oxidation stability.

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