Method for Processing Substrate, Apparatus for Processing Substrate, Method for Conveying Substrate and Mechanism for Conveying Substrate

Abstract

A method for processing a substrate and an apparatus for processing a substrate are provided, where a substrate can be prevented from being damaged during conveyance of the substrate, including turning over of the substrate, and the apparatus for processing a substrate having this mechanism for conveying a substrate is miniaturized, so that the area for installment can be reduced.[Means for Achieving Object] An apparatus for processing a substrate which divides a mother substrate into unit substrates is provided with a scribing portion 3 for drawing a scribe line on a mother substrate, a breaking portion 4 for breaking a mother substrate along the formed scribe line, and a portion for conveying a substrate 2 for conveying a mother substrate or a unit substrate at least between the above described respective portions, wherein portion for conveying a substrate 2 has a number of rotational supports 51 and 73 with a suction surface for sucking and holding each substrate from a main surface, rotational supports 51 and 73 have rotational axes 52 and 72, respectively, as well as means for respectively sucking and rotating a substrate which rotates substrates around rotational axes 52 and 72, approximately simultaneously in a state where the substrates are sucked and held in such a manner that at least two main surfaces of each substrate are turned over in the upward and downward direction.

Description

TECHNICAL FIELD[0001]This invention relates to a method for conveying a substrate according to which a substrate is turned over and conveyed, an apparatus for conveying a substrate, as well as a method for processing a substrate using this method and apparatus and an apparatus for processing a substrate. The invention particularly relates to a method for processing a substrate according to which a scribe line is drawn on a mother substrate and the above described mother substrate is divided into unit substrates along the drawn scribe line, and an apparatus for processing a substrate.BACKGROUND TECHNOLOGY[0002]In recent years, the use of flat panel displays that are thin and can display in a small display area has been spreading. In liquid crystal display panels, which are one type of panel for such flat panel displays (FPD), two glass substrates are bonded together and liquid crystal is injected into the gap between these, and thus, a display panel is formed. Bonded mother substrate...

AI Technical Summary

Benefits of technology

[0020]In a method for processing a substrate and an apparatus for processing a substrate according to this invention, a mother substrate on which a scribe line has been drawn is sucked and held from a main surface using a number of suction members, each of which has a suction surface when the mother substrate is conveyed, and then, the above described suction members respectively rotated almost simultaneously, and thereby, at least two main surfaces of the mother substrate are turned over in the upward and downward direction, and therefore, the area that is required for turning over a substrate becomes small, and the time required for turning over a substrate becomes shorter. In addition, warping that occurs in a substrate when the substrate is turned over can be reduced, and therefore, warping inside the substrate can be suppressed, and thereby, unevenness can be prevented from occurring in the distribution of gap spacers between two substrates in a bonded substrate. Furthermore, it becomes possible to reduce the dimensions of the apparatus that is required for turning over a substrate, and the area for installment of the apparatus can be reduced.

[0021]In the above described method for processing a substrate, in the case where the respective suction members are rotated around rotational axes which are parallel to each other, extend in the longitudinal direction of the suction members and pass through approximately the center portions of the suction members in the width in the direction perpendicular to the longitudinal direction, the substrates can be rotated with a minimal rotational track and warping which occurs in a substrate at the time of rotation can be minimized, and thereby, the substrate can be prevented from being damaged.

[0022]In the above described method for processing a substrate, in the case where a mother substrate is divided in advance into small mother substrates in stripe form, and each of the divided small mother substrates in stripe form is sucked and held by any one suction member, two surfaces of a small mother substrate can be turned over in the upward and downward direction without dividing the substrate. In addition, the area that is required for turning over a small mother substrate in stripe form can be reduced, and the time required for turning over a substrate can be reduced.

[0023]Furthermore, the step of sequentially carrying out division of a mother substrate and conveyance of a mother substrate and a small mother substrate can be carried out consistently in one apparatus.

[0024]In the above described method for processing a substrate, in the case where a number of suction members, each of which having a suction surface, are used in such a manner that the suction members are rotated around rotational axes which are parallel to each other, extend in the longitudinal direction of the suction members and pass through approximately the center portion of each suction member in the width in the direction perpendicular to the longitudinal direction, a mother substrate or a small mother substrate is sucked and held from a main surface, and then, the distance between the axis lines of the respective rotational axes of adjacent suction members is changed before or at the time when the suction members are rotated, mother substrates can be sucked and held or rotated without making contact with each other, even when the size of and intervals between mother substrates are different from each other when placed on a table.

[0025]In the above described apparatus for processing a substrate, in the case where the rotational axes of the respective suction members are parallel to each other, extend in the longitudinal direction of the suction members, and pass through approximately the center portion of each suction member in the width in the direction perpendicular to the longitudinal direction, a substrate can be rotated with a minimal rotational track, and warping which occurs in a substrate at the time of rotation can be minimized, and thereby, the substrate can be prevented from being damaged.

Problems solved by technology

In addition, as mother substrates which are used for liquid crystal display panels increase in size, warping which occurs in a substrate when this substrate is turned over increases, causing warping inside the substrate, and thereby, there is a risk that the distribution of the gap spacers between the two substrates in the bonded substrate may become uneven.

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