Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

TO-can heater on flex circuit

a technology of flex circuits and heaters, applied in the field of hermetic packages, can solve the problems of large and more expensive “butterfly” packages, vcsels tend to have very poor radio frequency (rf) performance at the lower end of the temperature range, and negatively affect the performance of higher temperatur

Inactive Publication Date: 2006-02-02
INTEL CORP
View PDF8 Cites 63 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for high-speed applications, as the device operates heat is generated and a heat sink may be necessary to dissipate heat efficiently from the package.
Larger and more costly “butterfly” packages may be cooled with a passive heat sink or Peltier thermo-electric device.
TO-cans are inexpensive and typically uncooled.
During cold operation however, VCSELs tend to have very poor radio frequency (RF) performance at the lower end of the temperature range.
One can adjust some of the operating parameters to improve cold temperature performance, however this negatively impacts higher temperature performance.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • TO-can heater on flex circuit
  • TO-can heater on flex circuit
  • TO-can heater on flex circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] Referring now to the drawings, and more particularly to FIG. 1, there is shown a transistor-outline package (TO-can) 10 for housing an optoelectronic assembly. The package 10 includes an insulating base or substrate 12, a metal sealing member 14, and a metal cover 16. Preferably, the insulating base 12 is formed of a material with good thermal conductivity for directing dissipated heat away from the optoelectronic assembly. By using a high thermal conductivity material, the insulating base 12 is capable of effectively dissipating the heat of un-cooled active optical devices, e.g., diode lasers, and can incorporate integrated circuits, e.g., diode driver chips, into the optoelectronic package 10.

[0012] Suitable materials for the insulating base 12 include ceramics such as alumina, beryllium oxide (BeO), and aluminum nitride (AlN). The insulating base 12 includes an upper surface 18, a lower surface 20, and four substantially flat sidewalls 22 (two of which are shown) extendin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An optical device, such as a vertical cavity surface emitting laser (VCSEL) may be housed in a hermetic enclosure such as a transistor-outline (TO) can and form part of a transmitter optical subassembly (TOSA). The TOSA may be connected to a printed circuit board (PCB) with a flexible circuit. A heating element provided on the flexible circuit heats the hermetic enclosure to improve radio frequency (RF) performance of the optical device in cold ambient conditions.

Description

FIELD OF THE INVENTION [0001] Embodiments of the present invention relate to hermetic packages and, more particularly, to heated hermetic packages. BACKGROUND INFORMATION [0002] Optoelectronic components or active optical devices such as diode lasers, light-emitting diodes (LEDs), and photodiode detectors are used for a multitude of applications. Most optoelectronic components are typically sealed inside a hermetically sealed package for performance requirements and operational stability. For high-speed optical telecommunication applications hermetic sealed packages are standard. [0003] Transistor-Outline (TO) packages, or TO-cans as they are often referred, are one of the more inexpensive hermetic packages used to house optoelectronic components. Conventional TO-cans include a generally cylindrical metal cap and a metal header or base, to which the metal cap is attached. The outline or silhouette of the TO-can tends to resemble that of a discrete transistor; hence the name. In such...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/00
CPCH01S5/02212H01S5/0222H01S5/024H01S5/183H05K2201/10121H05K1/0243H05K1/189H05K2201/10022H05K1/0212
Inventor POSAMENTIER, JOSHUA D.
Owner INTEL CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com