Method and system for operating physical gas-phase deposition
A physical vapor deposition and device technology, which is applied in metal material coating process, ion implantation plating, coating, etc., can solve the problems that are difficult to realize, and achieve the effect of high device output
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[0019] According to the present invention, there are provided techniques related to integrated circuits and integrated circuit processing methods for manufacturing semiconductor devices. More specifically, the present invention provides a method and system for operating a physical vapor deposition process using active feedback control for fabricating semiconductor integrated circuit devices. It should be recognized, however, that the invention has broader applicability. For example, the invention can be applied to various other applications such as displays, MEMS.
[0020] FIG. 1 is a simplified cross-sectional illustration of a conventional PVD system 100 . As shown, a PVD system (which is widely used to deposit metal layers and related materials in the process of fabricating semiconductor integrated circuits) includes a flat metal target to be sputtered and a wafer to be coated opposite the metal target. Working gas (usually argon) fills the reaction chamber at low pressur...
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