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Binding method for magnetic material before inner-round dissection

A magnetic material and circular cutting technology, which is applied in the manufacture of inductors/transformers/magnets, electrical components, circuits, etc., can solve the problems of unfavorable product whole board inspection, chip dropping, loose and loose, etc., to achieve tight combination, not easy to drop chips, The effect of reducing the likelihood

Active Publication Date: 2007-03-14
SINO MAGNETICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using the above conventional method to bond the materials to be processed, the disadvantage is that the bonded materials are prone to chipping when the inner circle is cut in the water-based working fluid, even if there is no chipping after the cutting is completed. Chip phenomenon, also prone to loose and loose phenomenon, which is not conducive to the whole board inspection of products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] The D11*28 cylindrical magnets to be cut are respectively selected with surface-treated and untreated materials, soaked in pure diesel oil, wiped clean, and then directly use 502 according to 6-5-6-5-4 ( A total of 26) are arranged for bonding. Thereafter, the bonded magnet is processed to a thickness of 1.5 mm. Results There was no chip falling during the cutting process, and the bonded whole board was not scattered. The bonding strength of the cut whole board was close to that of conventional bonding diesel cutting. The results of the untreated surface and the surface treated surface are the same, and there is no difference.

Embodiment 2

[0015] Soak the D11*28 cylindrical magnets to be cut and processed in pure diesel oil, wipe them clean, and then use 502 to bond them in an arrangement of 6-5-6-5-4 per layer (26 pieces in total). Thereafter, the bonded magnet is processed to a thickness of 1.5 mm. Results There was no chip falling during the cutting process, and the bonded whole board was not scattered. The bonding strength of the cut whole board was close to that of conventional bonding diesel cutting.

Embodiment 3

[0017] Soak the D11*28 cylindrical magnets to be cut in kerosene saturated with chlorinated paraffin, wipe them clean, and then use 502 to arrange them in the order of 6-5-6-5-4 per layer (26 in total) Do the bonding. Thereafter, the bonded magnet is processed to a thickness of 1.5 mm. Results There was no chip falling during the cutting process, and the bonded whole board was not scattered. The bonding strength of the cut whole board was close to that of conventional bonding diesel cutting.

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PUM

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Abstract

This invention discloses one binding method for cut inner circle of magnetic materials, which comprises the following steps: adding one layer of non solvent and non evaporated organic liquid on the magnetic materials surface; then distributing magnetic materials for glue. Due to the one layer of non solvent organic liquid for glue, when in circle cutting, its work liquid cannot destroy magnetic materials surface adhesive intensity.

Description

technical field [0001] The invention relates to a bonding method for magnetic materials, in particular to a bonding method for magnetic materials before inner circle cutting. Background technique [0002] At present, in the process of cutting sintered magnets and monocrystalline silicon and polycrystalline silicon, the materials to be processed are generally cleaned and dried. The purpose of drying is to ensure that there is no residual moisture on the surface of the materials to be processed, and then use 502 instant dry glue to carry out Bonding; for products that have been placed for a long time after grinding, oiling (waste engine oil or other non-volatile lubricating oil) is usually required. For such products, alkali boiling and drying are generally required, and then instant drying with 502 Glue for bonding; Sometimes the materials to be processed are not directly bonded. Using the above conventional method to bond the materials to be processed, the disadvantage is t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F41/02
Inventor 杨斌
Owner SINO MAGNETICS TECH
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