Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Flexible circuit substrate manufacturing method

A technology for flexible circuit substrates and manufacturing methods, which is applied in the fields of printed circuit manufacturing, printed circuit, circuit inspection/identification, etc., and can solve problems such as product reliability, insufficient integration efficiency, and poor productivity.

Inactive Publication Date: 2006-12-27
DKUIL
View PDF0 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the production method of the flexible circuit board using a copper foil laminated film one by one has been pointed out that the productivity is not good, and the production method of the flexible circuit board of the reel-to-reel method is expected to be automated. This point can improve productivity, but there is a big deficiency in product reliability and integration efficiency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible circuit substrate manufacturing method
  • Flexible circuit substrate manufacturing method
  • Flexible circuit substrate manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, through which the purpose, features, and advantages of the present invention can be better understood.

[0017] Figure 1a and Figure 1b It is a process drawing which shows the manufacturing method of the flexible circuit board which concerns on the 1st Embodiment of this invention.

[0018] like Figure 1a and Figure 1b As shown, the manufacturing method of the flexible circuit substrate of the present invention provides that copper foil (Cu thin film) C is vapor-deposited on PI film (Poly Imide Film polyimide film) or polyester with reel to reel mode (Reel to Reel). A copper clad C-laminate film (CCL; CopperClad Laminate) 10 on a Polyester Film (S11), and a guide hole H for position sensing is provided at the edge of the copper clad C-laminate film 10 in the longitudinal direction (S12) .

[0019] The guide hole H for position sensi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a manufacture method which including the following steps: providing the first and second middle copper foil stacked film equipped with guide hole used for position sensor in the scroll-to-scroll mode respectively and performing pattern formation according to units, supplying and covering the first and the second middle covered layer film in the scroll-to-scroll mode, preparing respectively the first and the second middle FPCB; providing the first and second middle FPCB in the scroll-to-scroll mode, the upper and lower part of which provide the first and second exterior copper foil stacked film equipped with guide hole for position sensing in the scroll-to-scroll mode respectively, performing copper plating after performing partly adherence according to units and forming passed hole; covering respectively the first and the second exterior covered layer plate with opening area according to units, accomplishing the first and the second exterior FPCB.

Description

technical field [0001] The present invention relates to a method of manufacturing a flexible circuit board, and more particularly to a method of manufacturing a flexible circuit board in which an accurate position is obtained by sensing a guide hole for position sensing while utilizing a reel-to-reel method. Tracking, the pattern forming position, the bonding position of the cover layer film and the cover layer sheet, the position of the through hole or the position of the punching hole can be precisely aligned, and the lateral width of the copper foil that becomes the composition of the copper foil laminate film is limited. It has a small width, uses parallel light for exposure, and applies a glass mask with a chrome pattern to ensure a fine pattern (Fine Pattern), and relatively by reducing the error rate, ensuring reliability, and achieving integration. Minimize the number of layers of flexible circuit substrates. Background technique [0002] In general, a flexible prin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/02H05K3/00
CPCH05K1/0266H05K3/0026H05K3/0044H05K3/24H05K3/281H05K3/42
Inventor 李愉镛朴基浚梁润弘
Owner DKUIL
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com