Memory

A memory and memory cell technology, applied in the field of memory, can solve problems such as the increase in the size of memory cells

Inactive Publication Date: 2006-12-13
SANYO ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] But when Figure 34 In the conventional mask ROM shown, since one transistor 205 is provided for each memory cell 211, there is a problem that the size of the memory cell becomes large.

Method used

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no. 1 approach

[0047] refer to Figure 1 ~ Figure 4 , the configuration of the mask ROM according to the first embodiment of the present invention will be described.

[0048] Such as figure 1 As shown, the mask ROM of the first embodiment includes an address input circuit 1 , a row decoder 2 , a column decoder 3 , a sense amplifier 4 , an output circuit 5 , and a memory cell array 6 . In addition, a peripheral circuit is constituted by an address input circuit 1 , a row decoder 2 , a column decoder 3 , a sense amplifier 4 and an output circuit 5 . Address input circuit 1 outputs address data to row decoder 2 and column decoder 3 by inputting a predetermined address from the outside. In addition, a plurality of word lines (WL) 7 are connected to the column decoder 2 . Row decoder 2 receives address data from address input circuit 1, selects word line 7 corresponding to the input address data, and raises the potential of selected word line 7 to H level. In addition, a plurality of bit lin...

no. 2 approach

[0099] refer to Figure 23 ~ Figure 28 , the configuration of the MRAM (Magnetic Random Access Memory) according to the second embodiment of the present invention will be described. In this second embodiment, a cross-point type MRAM will be described by taking an example in which the drain region of the select transistor and the cathode of the diode included in the memory cell are formed by a common impurity region.

[0100] In the MRAM of the second embodiment, as Figure 23 As shown, each memory cell 59 arranged in the memory cell array 56 includes a diode 60 and a TMR (Tunneling Magneto Resistance) element 62 . In addition, one electrode of the TMR element 62 is connected to the anode of the diode 50 , and the other electrode is connected to the bit line (BL) 8 . The circuit configuration of the MRAM of the second embodiment other than the above is the same as the circuit configuration of the mask ROM of the first embodiment.

[0101] Additionally, the TMR element 62 as ...

no. 3 approach

[0116] Figure 32 It is a plan layout diagram showing the structure of the mask ROM according to the third embodiment of the present invention. Figure 33 is zoomed in Figure 32 An enlarged plan view of a dotted-line region D of the mask ROM according to the third embodiment of the present invention is shown. Next, refer to Figure 32 and Figure 33 , the structure of the mask ROM according to the third embodiment of the present invention will be described.

[0117] In the third embodiment mask ROM, such as Figure 32 and Figure 33 As shown, unlike the mask ROM of the above-mentioned first embodiment, the n-type impurity region 114 and the source region 117 serving as the drain region on the formation region of the selection transistor 11a and the gate electrode 19a are extended in an oblique direction. The vicinity of the intersecting part, so that the top view, with the figure 1 The extending direction of the n-type impurity region 114 on the formation region of th...

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Abstract

The invention provides the computer memory which can reduce the memory cell. In the computer memory, the first gate electrode of the first selection transistor, the second gate electrode of the second selection transistor and the word line are integrally installed, on the forming area of memory cell, and they is cross-configured with the first impurity area on the first selection transistor and the forming area of second selection transistor, when they extend along the tilted direction of the first impurity extending on the forming area of memory cell.

Description

technical field [0001] The present invention relates to a memory, in particular to a mask ROM or the like. Background technique [0002] Conventionally, a mask ROM is known as an example of a memory. Such a mask ROM is disclosed, for example, in JP-A-5-275656. [0003] Figure 34 It is a plan layout diagram showing the structure of a conventional mask ROM based on a contact method. Figure 35 yes Figure 34 A cross-sectional view along line 500-500 of a previous contact-based mask ROM is shown. refer to Figure 34 with Figure 35 , in the conventional mask ROM based on the contact method, a plurality of impurity regions 202 where impurities are diffused are formed at predetermined intervals on the upper surface of the substrate 201 . In addition, on the upper surface of the substrate 201 corresponding to between two adjacent impurity regions 202, a word line 204 serving as a gate electrode is formed via an insulating film 203. One transistor 205 is formed by the word li...

Claims

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Application Information

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IPC IPC(8): H01L27/105
Inventor 山田光一
Owner SANYO ELECTRIC CO LTD
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