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Method of manufacturing laminated substrate

A manufacturing method and a technology of laminated substrates, applied in the field of manufacturing such electronic components and manufacturing such laminated substrates, can solve the problems of reduced grinding efficiency, increased risk, and the use of multi-layer wiring substrates, so as to improve grinding accuracy and simplify Grinding process, effect of preventing load concentration

Inactive Publication Date: 2006-11-01
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existence of such a region makes it difficult to use the multilayer wiring substrate as it is after pressing, and in addition, affects the grinding process to make the substrate uniform
In other words, it will be difficult to determine the reference plane at the time of grinding and to increase the precision of grinding above a certain level, and the grinding efficiency will decrease due to an increase in the amount of grinding
In addition, when the number of laminated layers increases, if lamination is performed on such a substrate as it is, there is a greater risk of position shift during lamination, or lamination pressure cannot be uniformly applied to the substrate.

Method used

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  • Method of manufacturing laminated substrate
  • Method of manufacturing laminated substrate
  • Method of manufacturing laminated substrate

Examples

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Embodiment Construction

[0026] Embodiments of the present invention will be described below with reference to the drawings.

[0027] Figure 1A and 1B A buffer structure used in a pressing process according to an embodiment of the present invention is shown, in which a stacked state of a buffer member, a substrate, an RCC, and the like is shown in cross section. Figure 1A shows the overall structure, while Figure 1B is showing Figure 1A Magnified view of region 1B shown in . In the pressing process, the RCC 5, the stainless steel plate 7 and the cushioning member 9 are stacked in the stated order at the center of both sides of the thin plate-like substrate 3, and the press plate of the press (see Figure 4 ) are placed outside of them. The RCC 5 is formed by laminating a copper foil 5 b and a resin layer 5 a , and is oriented such that the resin layer 5 a side faces the substrate 3 . The substrate 3 is used as a core substrate, the RCC 5 is used as a metal foil with resin (ie, a metal foil to w...

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Abstract

In a press process, a buffer member is placed on an RCC with a stainless steel plate between in such a way that the long sides and the short sides of the buffer member are aligned with the long sides and the short sides of the RCC respectively. The length of the long sides and the length of the short sides of the buffer member are designed to be smaller than the lengths of the long sides and the length of the short sides of the RCC respectively. With this feature, it is possible to reduce convexity on the RCC that is created in the peripheral region upon pressing the RCC to a core member.

Description

technical field [0001] The present invention relates to an electronic component typified by a so-called multilayer wiring substrate by laminating metal foils with resin attached on both sides on both sides of a substrate and a method of manufacturing such an electronic component. made. More particularly, the present invention relates to a laminated substrate having a very good surface flatness such that post-processing such as grinding can be efficiently performed on the substrate and a method of manufacturing such a laminated substrate. Background technique [0002] Electronic components called multilayer wiring substrates have been developed in order to achieve densification of electronic devices. In a multilayer wiring substrate, various wirings for being provided on a printed circuit board are provided in a laminated substrate so that high-density mounting can be realized. In a specific manufacturing method, wiring, electrodes, etc. are formed on the upper and lower su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46B23B7/00H05K3/00
CPCB32B37/0007B32B37/0046B32B2457/08H05K3/4611H05K3/4652H05K2201/0358H05K2203/068H05K3/00H05K3/46
Inventor 后藤真史桑岛一川畑贤一
Owner TDK CORPARATION
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