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Low-solid content water based clean-free welding flux without volatile organic substance and halogen

A technology with volatile organic compounds and low solid content, applied in welding medium, welding equipment, welding/cutting medium/material, etc., can solve problems such as operator hazard, fire, surface ozone destruction, etc., and achieve good solder spreadability and transparent tin good effect

Inactive Publication Date: 2006-10-11
广东中实金属有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, fluxes are divided into two categories: rosin-based liquid fluxes and no-cleaning fluxes. These fluxes use low-boiling alcohols, esters, and ketones such as ethanol, methanol, isopropanol, ethyl acetate, and butyl acetate. Ester, isobutyl acetate, and acetone are used as carriers. These organic solvents are easily volatile organic compounds (VOC). These organic solvents are toxic to the human body. During production and use, due to heating, they volatilize quickly and emit into the air. It will cause pollution and cause damage to the surface ozone. According to environmental protection requirements, it is restricted to use and eventually banned.
These organic solvents are flammable and explosive dangerous goods. When the ambient temperature is high, the air is not circulated, and the static spark exists, it is easy to cause fire and explosion; it will bring great harm to the operator. Therefore, deionized water is used instead of the current auxiliary agent. VOC substances in flux is imperative

Method used

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  • Low-solid content water based clean-free welding flux without volatile organic substance and halogen

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] This is a medium-active, VOC-free, halogen-free, low-solid content water-based no-clean flux, suitable for spraying the flux on the soldering surface of the PCB.

[0024] The raw materials (KG) are: succinic acid 0.5, glutaric acid 1.8, polyethylene oxide 0.5, Ld-1340.05, ethylene glycol 2.5, benzotriazole 0.04, deionized water 94.61.

[0025] Preparation method: first inject a small amount of deionized water into a clean stainless steel kettle with a stirring device, add the film-forming agent into the kettle, soak for half an hour to 1 hour, then pour the remaining deionized water into the kettle, Stir under low temperature to completely dissolve the film-forming agent, then add wetting agent, cosolvent, corrosion inhibitor in turn, when the material is completely dissolved, add the activator, stir until completely dissolved, mix evenly, stop stirring, After filtration is the product.

Embodiment 2

[0027] This is a medium-active, VOC-free, halogen-free, low-solid-content water-based no-clean flux, which is suitable for coating the flux on the soldering surface of the PCB by foaming.

[0028] Raw materials (KG) are: 0.8 malic acid, 0.5 glycolic acid, 1.2 ammonium succinate, 0.2 polyethylacrylamide, 0.3 poly-N-vinylpyrrolidone, 0.1 Ld-134, 2.5 propylene glycol, 0.05 benzotriazole, laurel Amide 0.04, ethylene glycol phenyl ether 0.04, water 94.27.

[0029] The preparation method is the same as in Example 1. The difference is that the blowing agent is also added in sequence.

Embodiment 3

[0031] This is a medium-active, VOC-free, halogen-free, low-solid content water-based no-clean flux, suitable for dipping and coating the flux on the soldering surface of the PCB.

[0032] The raw materials (KG) are: salicylic acid 1.5, triethanolamine 1.5, sorbitol 0.6, Ld-1540.04, glycerol 3, benzotriazole 0.04, water 93.32.

[0033] The preparation method is the same as in Example 1.

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Abstract

The invention relates to a organic non-halogen low-solid water-based washing-free welding flux with low activity and non-volatility, which can be coated on the welding surface of PCB plate via spraying, foaming and dipping. It comprises following components: organic acid organic amine activator in 1.0-4.0; film former in 0.5-1.0; wetting agent in 0.03-0.20; inhibitor in 0.04-0.10, some water, and assisting solvent in 2.0-6.0 and / or vesicant in 0.04-0.10. The invention has better spreading property; and with it, the PCB plate has better tin transparent property; the surface has no left matter after welding, since the activator is decomposed or sublimed in welding temperature; and it can avoid VOC material. And it is environment friendly.

Description

technical field [0001] The invention relates to a soldering flux, in particular to a non-volatile, halogen-free, low-solid-content water-based no-cleaning flux on the soldering surface of a printed circuit board (PCB). technical background [0002] At present, fluxes are divided into two categories: rosin-based liquid fluxes and no-cleaning fluxes. These fluxes use low-boiling alcohols, esters, and ketones such as ethanol, methanol, isopropanol, ethyl acetate, and butyl acetate. Ester, isobutyl acetate, and acetone are used as carriers. These organic solvents are easily volatile organic compounds (VOC). These organic solvents are toxic to the human body. During production and use, due to heating, they volatilize quickly and emit into the air. It will cause pollution and cause damage to surface ozone. According to environmental protection requirements, it is restricted to use and eventually banned. These organic solvents are flammable and explosive dangerous goods. When the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36B23K35/38
Inventor 丁飞
Owner 广东中实金属有限公司
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