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Anisotropic conductive glue and its preparing method

An anisotropic, conductive adhesive technology, applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of insufficient preparation process, high contact resistance of conductive adhesive, complex synthesis of matrix resin, etc., and achieve the preparation process Simple, high bond strength effect

Inactive Publication Date: 2006-08-23
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although the current application of anisotropic conductive adhesives has been involved in smart cards, LCDs, LEDs, digital cameras, mobile phones, laptop computers and other information, microelectronics, and optoelectronic products, the contact resistance of conductive adhesives widely exists so far is high. , Unstable performance under the action of high-frequency field and other shortcomings, which limit its wider application
Especially after experiencing high temperature and high humidity (85℃ / 85%RH) aging test, the resistance of some conductive adhesive joints will increase significantly, and even interface delamination and open circuit will occur in serious cases, resulting in electrical connection failure and mechanical performance decline
[0004] Although some existing technologies are working to solve some of the above-mentioned deficiencies, their disadvantages are that they involve complex synthesis of some matrix resins, and some additional processing steps must be implemented, and the preparation process is not simple enough.
Moreover, the reliability of the conductive adhesive in the prior art needs to be further improved

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Embodiment 1: By mechanical stirring method, nano-silicon powder, nano-Cu, and conductive microspheres (Sekisui Chemical, average particle diameter of 5 microns) are fully mixed to prepare a solid-phase mixture (the first mixture);

[0033] By passing epoxy resin (Shanghai Synthetic Resin Factory, brand name 6002) and epoxy curing agent (imidazoles, brand name 12B02) into a liquid-solid mixture (second mixture) through a three-roller mill and a centrifugal degassing homogenizer .

[0034] The two sets of mixtures are then mixed together until the solid powder is completely dispersed and wetted. Centrifuge the final mixture in a centrifugal defoaming and homogenizing machine for another 5 minutes to make anisotropic conductive adhesive.

[0035] The total components and weight percentages of the conductive adhesive are as follows:

[0036] Nano silicon powder 5%; Nano Cu 3.6%;

[0037] Conductive microspheres 10.2%; Epoxy resin 6002 69.2%;

[0038] Epoxy curing agent...

Embodiment 2

[0040] Embodiment two: by mechanical stirring method, nano-SiO 2 , nanometer Al, conductive silver powder (average particle diameter 5 microns) are fully mixed, prepare solid-phase mixture (the first mixture);

[0041] By passing epoxy resin (Dow Chemical, brand name DER351) and epoxy curing agent (boronamines, 594; imidazoles, brand name 12B02) through a three-roller mill and a centrifugal degassing homogenizer to make a liquid-solid mixture (second mixture).

[0042]The two sets of mixtures are then mixed together until the solid powder is completely dispersed and wetted. Centrifuge the final mixture in a centrifugal defoaming and homogenizing machine for another 5 minutes to make anisotropic conductive adhesive.

[0043] The total components and weight percentages of the conductive adhesive are as follows:

[0044] nano-SiO 2 5.2%; Nano Al 3.4%;

[0045] Conductive silver powder 12.2%; epoxy resin 6002 67.2%;

[0046] Epoxy curing agent 594 8%; Epoxy accelerato...

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Abstract

The present invention relates to a kind of anisotropic conductive glue and its preparation process. The anisotropic conductive glue consists of conducting particle 8-12 wt%; micron and nanometer level filling material I capable of lowering the thermodynamic expansion coefficient 0.5-10 wt%; micron and nanometer level filling material II with self oxidizing sacrificing property in wet and hot environment 0.5-10 wt%; epoxy resin 50-85 wt%; and latent epoxy resin curing agent 5-18 wt%. The preparation process of the anisotropic conductive glue includes the following steps: mixing conducting particle and micron and nanometer level filling material to form the first solid mixture; mixing epoxy resin and latent epoxy resin curing agent to form the second mixture; and mixing the first mixture and the second mixture homogeneously to form the anisotropic conductive glue.

Description

technical field [0001] The invention relates to a conductive adhesive and a preparation method thereof, in particular to an anisotropic conductive adhesive and a preparation method thereof. Background technique [0002] In the manufacture of microelectronics, optoelectronics, flat panel displays, microelectromechanical systems (MEMS), smart cards and other devices and products, conductive adhesive chip connection materials are widely used to undertake mechanical and electrical connections and realize the interconnection of chips and substrates. There are two main types of conductive adhesive chip connection technology: one is isotropic conductive adhesive technology (Isotropical Conductive Adhesives, ICA), commonly known as silver glue, conductive in all directions, mainly using screen printing technology and heat curing; The other type is Anisotropically Conductive Adhesives or Films (ACA or ACF for short), which only conduct electricity in the Z direction and maintain insu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02
Inventor 张建华
Owner SHANGHAI UNIV
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