Plasma cleansing apparatus that eliminates organic and oxidative contaminant and may effectively dissipate heat and eliminate exhaust gas and integrated system for the same

Abstract

A plasma cleansing apparatus that eliminates organic and oxidative contaminant and effectively dissipates heat and eliminates exhaust gas comprises an electrode unit, an exothermic unit, a raw gas ducting unit, a raw gas supply ducting unit, and an air drawing and exhausting unit. The exothermic unit is provided with a raised exothermic plate contacting one side of the electrode unit and with an exothermic wall fitting to the plate for dissipation of the heat of electrode unit. A first gas passageway communicating with the exterior is provided at the top end of the air drawing and exhausting unit, while a second gas passageway communicating with the exterior is provided at the bottom end of the air drawing and exhausting unit; the first gas passageway works with the second gas passageway to form a gas discharge function for heat dissipation, an air drawing function for gas discharge, or the two-in-one function.

Description

technical field [0001] The invention relates to a plasma cleaning device capable of removing organic matter and oxide pollution and an integrated system thereof. Background technique [0002] In the general product manufacturing process, regardless of any kind of manufacturing process, the surface cleanliness of all materials often affects subsequent processes such as vacuum evaporation, coating and bonding of materials, and the adhesion between different materials and Tight binding can make a big difference. Therefore, the cleaning of the material surface is a very important process. The surface cleaning method used in the past is to use chemicals to clean the surface of the material. However, the chemicals used in these methods will cause problems such as environmental pollution, so their use is restricted. [0003] Therefore, in order to solve the above problems, many new surface cleaning methods have been developed. Among these new surface cleaning methods, there is a ...

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Problems solved by technology

[0007] In order to use the plasma generated by the same principle as above for cleaning, the object to be cleaned is placed in a suitable position in the space between the two electrodes for cleaning, but the limitation of this method is that only very thin objects to be cleaned can be used. being cleaned

The reason is: if the object to be cleaned is not an insulator but a conductive metal or semiconductor, it will affect and damage the object to be cleaned according to the specific situation of high voltage, so the field of using this cleaning method is quite limited

[0008] Moreover, when the plasma is discharged to the outside material for cleaning, due to the characteristics of the normal pressure plasma, the plasma will cause the generation of substances harmful to the human body such as ozone, which will affect the safety of the staff.

[0009] Also, when the distance between the plasma generating equipment and the material is very close, arcing between the material and the electrode may occur, which will damage the material

Moreover, because the voltage used by the plasma generating equipment is a high voltage, there is a problem that an electric shock may cause harm to the user if the user does not operate properly.

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