Double layer printed circuit board capable of implementing impedance control

Abstract

A double-layer printed-circuit board capable of realizing the impedance control comprises a dielectric layer and several high-speed signal transmission lines and a ground plane adjacent to each high-speed signal transmission line on the dielectric layer. Using the said double-layer printed-circuit board can input the two-dimensional sectional graphic of the double-layer printed-circuit board to an artificial software. An ideal characteristic impedance value is obtained via the multiple adjustment of parameter value of the said high-speed signal transmission line and the relative location of the high-speed signal transmission line and the ground plane, the multiple input of the two-dimensional graphic and the multiple computation of the artificial software after comparing the characteristic impedance value of the high-speed signal transmission line counted by the artificial software and its standard impedance value.

Description

【Technical field】 [0001] The invention relates to a printed circuit board (Printed Circuit Board, referred to as PCB hereinafter), in particular to a two-layer printed circuit board capable of realizing impedance control in high-speed signal wiring. 【Background technique】 [0002] As the output switching speed of integrated circuits increases and the wiring density of PCB increases, signal integrity has become one of the issues that must be concerned in high-speed digital PCB design. Factors such as the parameters of components and PCB, the layout of components on PCB, and the wiring of high-speed signals will all cause signal integrity problems, resulting in unstable system operation, or even not working at all. How to fully consider the signal integrity factor in the PCB design process and take effective control measures has become a hot topic in the PCB design industry today. For transmission lines on PCBs, the most important thing to maintain signal integrity is impedan...

AI Technical Summary

Problems solved by technology

The thickness of the dielectric layer is 56mil. According to the above empirical formula, the characteristic impedance of the transmission line 150 is 150 ohms, which obviously does not meet the requirements of impedance matching. If the characteristic impedance of the transmission line 150 is to be equal to 60 ohms, according to the above empirical formula, W is the transmission line The width of 150 needs to reach 82mil, which is unreasonable in PCB design

And a ground layer 160 does not take into account the impedance control requirements of several transmission lines 150. When using simulation software, the two-dimensional cross-section formed by several transmission lines 150 and a ground layer 160 cannot control the characteristic impedance value of each transmission line 150.

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