Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit board with embedded conductive circuit and manufacturing method thereof

A technology of conductive lines and production methods, which is applied in the directions of multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problem of high cost of laser cutting, and achieve the effect of low cost and reduced production cost.

Active Publication Date: 2022-04-01
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the cost of laser cutting is higher

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board with embedded conductive circuit and manufacturing method thereof
  • Circuit board with embedded conductive circuit and manufacturing method thereof
  • Circuit board with embedded conductive circuit and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0069] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0070] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0071] In order to further illustrate the technical means and ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for manufacturing a circuit board with a built-in conductive circuit, which comprises the following steps of: providing a circuit substrate which comprises a core layer and a first inner conductive circuit layer arranged on the core layer; forming a first insulating layer and a first copper foil layer on the first inner conductive circuit layer; forming a first opening in the first copper foil layer; forming a second opening in the first insulating layer through plasma etching, the second opening corresponding to the first opening to form a first opening area, and at least forming a first conductive layer in the first opening area; and removing the first copper foil layer and the first conductive layer above the first insulating layer to obtain the circuit board with the embedded conductive circuit. The impedance performance of the first conductive part manufactured by the method provided by the invention is relatively good. The invention also provides the circuit board with the embedded conductive circuit, which is manufactured by the manufacturing method.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board with embedded conductive lines and a manufacturing method thereof. Background technique [0002] At present, when manufacturing a circuit board, it is usually necessary to make an opening in the circuit board, and then fill the opening with a conductive material or electroplating to realize the connection between the circuit board and external electronic components. When making openings, laser drilling is usually used. [0003] However, the shape of the openings made by laser drilling is large at the top and small at the bottom, that is, roughly trapezoidal, and the shape of the openings is not easy to control. Therefore, after filling the openings with conductive materials or electroplating to form the conductive parts, the shape of the conductive parts is also trapezoidal, which is not conducive to controlling the impedance of the conductive part. At th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/06H05K3/42H05K3/46
Inventor 王胜辉
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com