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Transition block and optical chip packaging base

A technology of packaging base and transition block, applied in the 5G field, can solve the problems of low yield, high production cost, low bonding wire efficiency, etc., and achieve the effect of high yield, low cost and mature refining process

Pending Publication Date: 2021-08-03
SHENZHEN ZHONGXING SINDI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] A transition block and optical chip packaging base, which solves technical problems such as high production cost, low bonding wire efficiency, and low yield rate

Method used

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  • Transition block and optical chip packaging base
  • Transition block and optical chip packaging base
  • Transition block and optical chip packaging base

Examples

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Embodiment Construction

[0031] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical The orientations or positional relationships indicated by "straight", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description , rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus should ...

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Abstract

The invention discloses a transition block and an optical chip packaging base, and the transition block comprises a block body made of a SiC material, wherein the front surface of the block body is provided with a signal return path and a microstrip line, the two sides of the block body are respectively provided with a metalized fixing groove, and the back surface of the block body is a gold-tin back surface. The method has the advantages of high efficiency, high compatibility, good coupling, reliable quality, high yield and low cost. The method is applied to the technical field of 5G.

Description

technical field [0001] The invention relates to the field of 5G technology, in particular to a transition block and an optical chip packaging base. Background technique [0002] 2020 is the beginning year of 5G construction. At the same time, the country is also developing 5G construction as a national strategic direction from the top-level design. 5G carries the mission of "new infrastructure" and will drive trillions of output. The Ministry of Industry and Information Technology and the National Development and Reform Commission hope to promote the in-depth development of information consumption. By 2021, the scale of information consumption will reach 6 trillion yuan. The leading role of information technology in the consumption field will be significantly enhanced, and the output of related fields will reach 15 trillion yuan, the notice clearly promotes the construction of 5G. [0003] The optical chip package base is used in the optical communication system as a key co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/66H01S5/023H01S5/0232H01S5/024
CPCH01L23/66H01L2223/6627H01S5/02415
Inventor 章九林宁亚茹杨栋
Owner SHENZHEN ZHONGXING SINDI TECH CO LTD
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