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Jetting electroplating method directly of nozzle

A nozzle and jet flow technology, which is applied in the field of nozzle vertical jet flow electroplating, can solve the problems of low TP value of high aspect ratio backplane penetration capability, accelerated cracking of electroplating additives, and high cost, so as to improve the electroplating penetration capability and improve The effect of low potion concentration and electroplating cost

Inactive Publication Date: 2006-03-15
WUS PRINTED CIRCUIT (KUNSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0006] 2. Aeration will bring a large amount of oxygen into the bath, which will speed up the cracking of electroplating additives, reduce the service life and increase the consumption
[0008] The disadvantages of this method are: the spray pressure formed is not large, the spray flow rate is small, and the TP value of the high aspect ratio backplane penetration capability is not high (it is still difficult to electroplate thicker copper in the hole)
In addition, this continuous fully automated assembly line operation has high cost and high failure rate, which is not conducive to popularization and use.

Method used

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  • Jetting electroplating method directly of nozzle
  • Jetting electroplating method directly of nozzle
  • Jetting electroplating method directly of nozzle

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Experimental program
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Effect test

Embodiment

[0024] Embodiment: the present invention carries out electroplating operation by following method:

[0025] The anode titanium basket 2 and the cathode PCB board 1 are placed in the same electroplating bath, and a plurality of nozzles 4 are arranged in the gaps between a plurality of anode titanium baskets close to the tank wall, and a plurality of nozzles 5 are arranged on each nozzle, and electroplating The liquid is pumped out by the pump and sprayed out from the nozzle through the nozzle, and the spray flow is perpendicular to the PCB board surface 1, forcing the liquid medicine exchange inside and outside the hole; and, using the horizontal swing in the direction A perpendicular to the spray flow direction of the nozzle, so that all places in the PCB board surface The potion is delivered evenly.

[0026] In addition, the gas pipe 3 at the lower end of the tank body is changed from two to one, and it is only opened for use when the tank body is treated with activated carbo...

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PUM

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Abstract

The invention opens a plating method of the semiautomatic vertical jet. The process is to install the Ti skep that is set the effuser between the space and the PCB in the plating vat. The horizontal pendulum is used to transfer the liquid uniformly. The inflating pipe that is changed from two into one is used in the active carbon or reverse tank treatment.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board (PCB) manufacturing and relates to a nozzle vertical jet flow electroplating method. Background technique [0002] There are usually two types of existing electroplating methods: [0003] One is the inflated and stirred immersion plating method, that is, immersing the anode titanium basket and the cathode PCB in the electroplating bath, and adopting the method of pumping air under the PCB and combining the horizontal swing in the B direction perpendicular to the PCB surface to make the inside of the PCB hole Potions are exchanged (eg figure 1 shown). [0004] This method has disadvantages such as weak liquid exchange ability in the hole of high aspect ratio plate, low ability to penetrate the hole, and large consumption of oxygen electroplating additives, mainly due to: [0005] 1. Air pumping has a stronger convective mass transfer effect on the liquid medicine outside the high a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/08
Inventor 李文宾
Owner WUS PRINTED CIRCUIT (KUNSHAN) CO LTD
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