Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for mfg. plasma display

A plasma and manufacturing method technology, applied in the direction of discharge tube/lamp manufacturing, cold cathode manufacturing, tube/lamp screen manufacturing, etc., can solve problems such as poor crimping effect, broken glass substrate, and infirmity, etc., to achieve Improve crimping efficiency and success rate, prevent damage, and achieve uniform bonding

Inactive Publication Date: 2006-01-11
四川世纪双虹显示器件份有限公司
View PDF0 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing plasma manufacturing method only heats the surface of the glass substrate with the FPC film, and the heating is uneven; some technologies do not perform pre-pressing, but directly press the ACF film on the glass substrate and then directly press it.
In this way, it is easy to cause the glass substrate to break during crimping, the crimping effect is not good, it is not firm, the resistivity of the crimping point is relatively large, and the success rate is low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] First, paste the anisotropic conductive film ACF film on the printed electrode of the glass substrate; then, put the glass substrate with the anisotropic conductive film ACF film on the crimping machine for low-temperature pre-compression, and heat the glass substrate up and down at the same time. 100℃, the pressure is 5Kg / cm 2 ; Secondly, peel off the upper layer of the anisotropic conductive film ACF film, leaving the adhesive layer of the anisotropic conductive film ACF film; paste the flexible circuit board film FPC film on the printed electrode of the glass substrate and paste the anisotropic conductive film ACF film, and then The glass substrate is heated up and down at the same time, the temperature is 80℃, and the pressure is 4~6Kg / cm 2 ; When the plasma glass substrate is heated, a rubber elastic soft gasket is placed on the heated glass substrate. Place the FPC film on the flexible circuit board on the crimping machine and press it firmly at a temperature of 200°C...

Embodiment 2

[0018] First, paste the anisotropic conductive film ACF film on the printed electrode of the glass substrate; then, put the glass substrate with the anisotropic conductive film ACF film on the crimping machine for low-temperature pre-compression, and heat the glass substrate up and down at the same time. 80℃, the pressure is 6Kg / cm 2 ; Secondly, peel off the upper layer of the anisotropic conductive film ACF film, leaving the adhesive layer of the anisotropic conductive film ACF film; paste the flexible circuit board film FPC film on the printed electrode of the glass substrate and paste the anisotropic conductive film ACF film, and then The glass substrate is heated up and down at the same time, the temperature is 100℃, and the pressure is 4~6Kg / cm 2 ; When the plasma glass substrate is heated, a rubber elastic soft gasket is placed on the heated glass substrate. Place the FPC film on the flexible circuit board on the crimping machine and press it firmly at a temperature of 180°C...

Embodiment 3

[0020] First, paste the anisotropic conductive film ACF film on the printed electrode of the glass substrate; then, put the glass substrate with the anisotropic conductive film ACF film on the crimping machine for low-temperature pre-compression, and heat the glass substrate up and down at the same time. 110℃, the pressure is 4Kg / cm 2 ; Secondly, peel off the upper layer of the anisotropic conductive film ACF film, leaving the adhesive layer of the anisotropic conductive film ACF film; paste the flexible circuit board film FPC film on the printed electrode of the glass substrate and paste the anisotropic conductive film ACF film, and then The glass substrate is heated up and down at the same time, the temperature is 110℃, and the pressure is 4~6Kg / cm 2 ; When the plasma glass substrate is heated, a plastic elastic soft gasket is placed on the heated glass substrate. Place the FPC film on the flexible circuit board on the crimping machine and press it firmly at a temperature of 210...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention discloses a manufacture method for a plasma indicator, which adheres an ACF on a printed electrode of a glass base plate and puts the base plate on a crimp machine for pre-pressing the both sides at low temperature at the same time, then takes out the top layer of the ACF to keep its adhesion layer, a flexible PC film is adhered on the ACF of the printed electrode of the glass base plate then heats the both sides of the base plate at the same time and presses the place for placing the FPC film on the crimp machine tightly, finally, seals the FPC film and the glass base plate with a non-corrosive glue.

Description

Technical field [0001] The invention relates to a method for manufacturing a plasma display. Background technique [0002] In recent years, the plasma display device has attracted attention as a display screen with excellent visibility, and it has been developing in terms of high definition and large screen. [0003] Plasma display devices can be roughly divided into AC type and DC type as driving methods, and there are two types of discharge types: surface discharge type and opposed discharge type. At present, AC type and surface discharge type plasma display devices are the mainstream, and their development direction is gradually developing towards high definition and large screen. [0004] The existing plasma manufacturing method only heats the surface of the glass substrate on which the FPC film is attached, and the heating is uneven; some technologies do not perform pre-compression, but directly press the ACF film on the glass substrate and then directly perform compaction. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01J9/00H01J9/20
Inventor 姜凤山邢懋腾徐世文
Owner 四川世纪双虹显示器件份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com