Heat interface material and its producing method

A technology of thermal interface material and manufacturing method, which is applied in cooling/ventilation/heating transformation, electrical components, side-by-side/stacking configuration, etc. The effect of increasing the thermal conductivity

Inactive Publication Date: 2005-10-19
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to overcome the problems of poor bonding between thermal interface materials, electronic components and heat sinks and poor thermal conductivity of thermal interface materials in the prior art, the purpose of the present invention is to provide a thermal interface material with thin thickness, excellent thermal conductivity and high thermal conductivity

Method used

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  • Heat interface material and its producing method
  • Heat interface material and its producing method
  • Heat interface material and its producing method

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Embodiment Construction

[0023] see figure 1 , the thermal interface material 10 provided by the present invention is formed on the base surface 22 of the heat dissipation base 21 . The thermal interface material 10 includes a thin film 12 formed on the base surface 22; and a thermally conductive adhesive 13 that is closely attached to the thin film 12. The thermally conductive adhesive 13 may include a silver adhesive or silica gel, such as G751 adhesive (produced in Shin- Etsu Corporation). The thin film 12 is composed of a shape memory alloy 11, and is formed on the surface of the base 22 by sputtering deposition method at the working temperature of the electronic components. This method can make the thermal interface material 10 and the base 21 tightly bonded into one body. Wherein, the shape memory alloy 11 can be selected from nano-alloys such as NiTiCu, CuAlNi, CuAlZn, NiTiAlCu, NiTiAlZn or NiTiAlZnCu; the thickness range of the thin film 12 is 100-2000 nanometers, preferably 500-1000 nanomete...

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Abstract

This invention provides a thermal interface material including a film and a heat conduction glue closely adhered to said film, among which, said film is composed of a shape memory alloy possibly containing the nm Ni Ti Cu alloy formed on the base surface by vacuum sputter deposition. In addition, this invention also relates to a manufacturing method for the material. Said material contains nm alloy films with a shape memory function, which can resume the original deposited shape under a heat source temperature to increase the contact area with the radiation device, so the material has fine heat conductivity and conduction efficiency.

Description

【Technical field】 [0001] The invention relates to a thermal interface material, in particular to a thermal interface material which improves the contact surface between a heat source and a heat dissipation device to improve heat dissipation performance and a manufacturing method thereof. 【Background technique】 [0002] With the increasing densification and miniaturization of integrated circuits, electronic components become smaller and operate at higher speeds, making their requirements for heat dissipation increasingly higher. Therefore, in order to dissipate the heat from the heat source as soon as possible, it has become a common practice in the industry to install a heat sink on the surface of the electronic component. It uses the high thermal conductivity of the material of the heat sink to quickly dissipate the heat to the outside. However, the surface of the heat sink and the heat source There is often a certain gap in the contact, so that the heat sink and the surfac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01L23/42H05K5/00H05K7/20
CPCH05K5/0021
Inventor 陈杰良
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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