Ultrasonic wire welding method and apparatus

Abstract

The present invention discloses one kind of ultrasonic wire welding method and apparatus. The welding apparatus includes two locating optical imaging systems with optical lens set and camera; and two horizontal turntables on the X-Y work benches with two exchangeable work sites each. When one of the two horizontal turntables locates under one of the two locating optical imaging systems, the other welds in the other optical imaging systems, and the course is exchanged and repeated. The present invention has raised LED wire welding efficiency, and increased IC chip wire welding area.

Description

technical field [0001] The present invention relates to a welding method or equipment suitable for semiconductors, solid devices or parts thereof used for conducting electric current leads, in particular to an ultrasonic wire welding method and a wire welding device. Background technique [0002] The integrated circuit chip IC or light-emitting diode LED is directly packaged on the circuit board PCB or the chip on the substrate (Chip on Board, referred to as COB), which has been widely used in such as computers, mobile phones, optical digital products, smart cards, clocks, Toys and other consumer electronic information products. Wire bonding is the basic process of COB, which requires the use of ultrasonic wire bonding methods and corresponding equipment. There is an automatic ultrasonic wire bonding machine specially used for bridging IC chips or LEDs with multiple wires and the corresponding pads on the PCB, including a welding head system, an X-Y table that can move in t...

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Problems solved by technology

Using point-to-point positioning for LED wire bonding is to first confirm two points on the PCB as the reference point, and then confirm the position of each point of the LED first, and then solder the wire. The time spent on confirming the position greatly improves the efficiency of machine soldering wire. lower, usually by nearly 50%

In order to save the time spent on confirming the position when using point-to-point positioning for IC chip bonding, it is only necessary to first confirm two points on the PCB board and the IC chip as reference points, then calculate the positions of other points, and then solder In this way, it is difficult to improve the accuracy of the welding line. Moreover, in the welding line area far away from the rotation center of the Θ turntable, the position deviation caused by the assembly error is too large, so that the welding line area is usually limited within the range of 50mm×50mm. In this It is difficult to ensure the accuracy of the welding wire position outside the range

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