TD-SCDMA mobile phone circuit board for implementing eftective integral distribution

A TD-SCDMA, circuit board technology, applied in the field of TD-SCDMA mobile phone circuit boards, can solve problems such as the inability to support and realize complex and advanced functions, and achieve the effect of optimized layout, smooth signal flow, and balanced layout

Inactive Publication Date: 2005-08-24
上海贝豪通讯电子有限公司
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, many aspects of the existing technology and equipment are far from being able to meet the above requirements. Among them, in terms of the overall layout of the hardware circuit board, the traditional design structure has been unable to support and realize so many complex and advanced functions. There is a new board layout to accommodate the above requirements

Method used

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  • TD-SCDMA mobile phone circuit board for implementing eftective integral distribution
  • TD-SCDMA mobile phone circuit board for implementing eftective integral distribution
  • TD-SCDMA mobile phone circuit board for implementing eftective integral distribution

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Embodiment Construction

[0024] Design is very complicated for the circuit board (PCB) of high-density mixed signal, and the layout processing of components and parts directly affects circuit performance and electromagnetic compatibility. Screen module 5 (Liquid Crystal Display Module, LCM), antenna 6, digital baseband part 7 (Digital Base Band, DBB), radio frequency 8 (RF) and analog baseband part 9 (Analog Base Band, ABB).

[0025] Because the layout of the radio frequency in the mobile phone directly affects the direction of the radio frequency line, it is the most critical and important part to dominate the performance of the RF part and even affect the important technical indicators of the entire mobile phone. Therefore, this embodiment takes the radio frequency module 8 as the criterion to define the radio frequency module. The layer where 8 is located is the lower layer of the circuit board 1 . see figure 1 As shown, the specific layout of the lower layer of the circuit board 1 is as follows: ...

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Abstract

This invention discloses a TD-SCDMA mobile phone circuit board realizing effective and integrating distribution. It includes LCD screen module, the antenna, the digital baseband part, the radio frequency and stimulant baseband part. The relating circuit board has the upper and the lower layer, the lower layer includes the antenna on the upper part, and the antenna is internally set in the mobile phone, the middle part is the radio frequency part and the lower part is the stimulant baseband part. The upper layer mainly includes the LCD screen module of the upper part and the digital baseband part of the bottom. This invention realizes the effective distribution of TD-SCDMA mobile phone circuit board. In order to avoid the interfere between the modules, it uses the shielding can effectively isolate the radio frequency module, the stimulant baseband part and the digital baseband part and realizes the minimization of the product.

Description

Technical field: [0001] The invention relates to a mobile phone circuit board, in particular to a TD-SCDMA mobile phone circuit board capable of realizing an effective overall layout. Background technique: [0002] TD-SCDMA (Time Division Synchronous Code Division Multiple Access) technology is the third generation (3G) mobile communication standard proposed by China in recent years, using smart antenna, software radio, joint detection, relay handover, downlink packet switching, high-speed data transmission, etc. A series of high-tech, with outstanding advantages such as high spectrum utilization rate, large system capacity, suitable for data services, low system cost, and in line with the development direction of mobile technology, can provide a variety of flexible and changeable services, not only can provide various 3G It is a common service, and can provide more advantageous and characteristic services, such as: simple voice and message services, multimedia services, pos...

Claims

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Application Information

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IPC IPC(8): H04M1/02H05K1/00H05K9/00
Inventor 田立平
Owner 上海贝豪通讯电子有限公司
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