Activating method for nonmetallic base material surface chemical coated metal

Abstract

The invention was about a technology of Ag-Pa compound activation, the non-metal material was activated by Ag and Pa, the other metal was plating the surface of it. Ag concentration of activate solution was 0.06-2g / L, Pa concentration of activate solution was 0.006-0.06g / L, the activate time was more than 10 seconds while the material activated in the Ag activate solution, more than 20 seconds in the Pa activate solution, the activate temperature was 40-60 deg.C. Its advantages include good activation, saving the use level of metal; fit for a lot of material; suit for the technology plating in the later process; fit for commercial production.

Description

technical field [0001] The invention relates to a method for chemically plating metal on the surface of a non-metal substrate, in particular to an activation method for chemically plating metal. technical background [0002] Electroless metal plating is a commonly used metal coating method, which can be carried out on metal and non-metal substrates. Before electroless plating on the surface of the non-metallic substrate to make it conductive, the non-substrate must be activated, and a catalyst that can catalyze the electroless plating must be deposited on its surface, otherwise the subsequent electroless plating cannot be carried out. As a pretreatment of electroless plating, the traditional activation process is to treat the substrate with SnCl 2 After the solution is sensitized, it is activated by a single noble metal solution such as palladium or silver. For example, Liu Shaozhi disclosed in his Chinese patent "A Fabric for Shielding Electromagne...

AI Technical Summary

Problems solved by technology

Although this activation method has a relatively simple process, if a single silver active solution is used, not only the amount of silver nitrate is large, but also the activation effect is found to be poor in actual production, resulting in large areas of missed plating in subsequent electroless plating, which cannot be used in production; If a single palladium activation solution is used, due to the high price and scarcity of palladium, the product cost is high and the product market competitiveness is not strong

Therefore, it has been proposed to use a new activation process of non-precious metals one after another. Gao Deshu et al. (Research on Colloidal Activation Solution for Non-metallic Plating [J], Surface Technology, 1993, 22) impregnated the ABS plastic substrate with nickel and copper hydroxide colloidal solution, with NaBH 4 Reduction of divalent nickel and copper to metal state, and then electroless plating, achieves a certain effect, but the binding force of the coating is poor, the activity is far lower than the activator made of palladium salt, and it is difficult to achieve complete coverage, and there are reports (non-metallic materials Research on Activation Process of Electroless Nickel Plating, Material Protection, Volume 34, Issue 2, February 2001) Activate ceramics or sodium glass with high concentration ammonium nickel salt, and then heat the adsorbed nickel salt at a temperature above 200°C It can be decomposed into a substance with high catalytic activity, and then the chemical plating can also receive a good chemical plating effect, but its high pyrolysis temperature cannot be used for polyurethane sponge, non-woven fabrics, cotton cloth, chemical fiber fabrics, fiber nets , fiber cloth and other substrates with low thermal degradation temperature, the application range is limited