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Producing method for solid niobium capacitor

A technology of niobium capacitors and manufacturing methods, which is applied in the field of manufacturing solid niobium capacitors, can solve problems such as heat generation, large dispersion rate, and heat generation, and achieve the effects of improved voltage resistance, stable performance, and low failure rate

Inactive Publication Date: 2005-05-11
宁夏星日电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 3. This technology uses water vapor to decompose Mn(NO 3 ) 2 The manganese dioxide obtained after the solution is used as the cathode material. Due to the existence of the resistance of the manganese dioxide itself when the current passes through, it will cause it to generate heat and generate heat, and a corresponding reaction will occur, and finally three oxides will be generated as the temperature varies. Dimanganese is a low-valence manganese oxide, and these oxides have a large resistance, which will block the leakage current, thereby improving the leakage current of the product, but if too much heat cannot be exported, it will cause the product to fail. Burned out (the product has not had time to heal itself)
[0008] Therefore, the niobium capacitor manufactured by the above process has defects such as insufficient LC capacity characteristics of the capacitor, large dispersion rate, lack of practicability, and must be improved

Method used

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  • Producing method for solid niobium capacitor
  • Producing method for solid niobium capacitor

Examples

Experimental program
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Effect test

Embodiment 1

[0039] 1. Powder mixing and forming:

[0040] Get 300 grams of niobium powder, weigh 12 grams of binder sodium stearate according to the weight ratio of 4%, mix the two evenly, and then press and form according to the required specifications.

[0041] 2. Binder removal, sintering, passivation:

[0042] Put 2000 pieces of the above-mentioned pressed niobium blocks in the crucible, at a temperature of 200-500°C and a vacuum pressure of 3-10×10 -3 Keep it under Pa condition for 30min, then cool it down to room temperature and take it out of the oven. This process is used to remove the binder.

[0043] Take niobium anode blocks with a single weight of 35mg and put them into the crucible according to 2000 pieces per pot, and sinter them at a temperature of 1150°C. After sintering, cool down to room temperature under vacuum conditions. Cool in a container filled with cold water for 10 minutes, take out the product, then immerse the product in pure ethanol solution, stay for 5 min...

Embodiment 2

[0056] According to the steps of Example 1, the loading capacity of each pot in Step 2 is changed to 4000, and after the sintering is completed, it is cooled in pure water (at room temperature) for 20 minutes, and all the other steps and conditions are the same as in Example 1.

Embodiment 3

[0058] According to the steps of Example 1, the concentration of nitric acid solution in Step 4 is changed to 0.3%, and all the other steps and conditions are the same as Example 1.

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Abstract

The method includes following steps: sintering; welding; forming; capsulizing; assembling; molding. The main technical character is: 1, the sinter cake is passivated by using cool pure water to reduce oxygen update rate of Niobium anode block; 2, in forming process the activate is made alternatively by using nitric acid solution and phosphoric acid solution, by this way the product in one hand gets the virtue of undercurrent due to using nitric acid solution, in other hand the product also has virtue of resistant to voltage due to using phosphoric acid solution; 3, in capsule process the cathode of niobium capacitor is made by using alternate immersion in manganous nitrate and silica gel solution.

Description

technical field [0001] The invention relates to the technical field of electronic component manufacturing, in particular to a method for manufacturing a solid niobium capacitor with large capacity per unit weight and good leakage current characteristics. Background technique [0002] Due to the development of miniaturization and high integration of IC or printed substrates, miniaturized and lightweight electronic equipment such as mobile phones, notebook computers, and electronic notebooks has become the mainstream of electronic equipment development, so it is necessary to develop miniaturized and large-capacity capacitors . Tantalum capacitors are widely used because of their excellent characteristics such as large capacity and stable performance. However, due to the relatively high atomic weight and density of tantalum, its unit weight is also relatively large, and its dielectric constant is also relatively high. [0003] Niobium and tantalum are congener elements, they ...

Claims

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Application Information

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IPC IPC(8): H01G9/00H01G9/04H01G9/15
Inventor 李春光董宁利钟景明
Owner 宁夏星日电子有限公司
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