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An after-treatment fluid for copper surface black oxidation

A post-treatment liquid, black oxidation technology, applied in the field of chemical treatment, can solve the problems of affecting the quality of the board, high price, etc., and achieve the effect of favorable bonding strength and low price

Inactive Publication Date: 2005-04-06
GUANGDONG TONESET SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As the reduction purpose, dimethylamine borane (DMAB) and diethylamine borane (DEAB) are usually selected as reducing agent at present, because they are expensive and easy to hydrolyze, the DMAB by-product remains in the solution after reduction, Accumulation, which forms particles on the board after accumulation, thus affecting the quality of the board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] Ethanolhydrazine 4.75 g / L

[0069] Thiourea 20 mg / L

[0070] NaOH 6 g / L

[0071] Deionized water up to 1 liter

Embodiment 2

[0073] Trimethylamine borane 4.0 g / L

[0074]Thiourea 20 mg / L

[0075] NaOH 6 g / L

[0076] Deionized water up to 1 liter

Embodiment 3

[0078] tert-butylamine borane 5.30 g / l

[0079] Thiourea 20 mg / L

[0080] NaOH 6 g / L

[0081] Deionized water up to 1 liter

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PUM

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Abstract

This invention relates to a kind of processing solution for copper black oxidation. It discloses the water-soluble reducer in the processing solution is tertiary-butyl alkyl borane, trimethyl alkyl borane, ethanol hydrazine or the combination of above compounds. This invention has many water-soluble reducer selections, can reduce the aerugo to copper effectively. The reducer is cheap and will not be hydrolysis. The reduced by-product is water-soluble, will not generate grain on the inner copper. It is good for the adherence of copper and semi-solidified piece.

Description

technical field [0001] The invention relates to the chemical treatment of the black oxidation of the inner copper surface of the printed circuit board. Background technique [0002] In the production process of multilayer printed circuit boards, in order to improve the bonding force between copper and prepreg (polymeric material), one of the commonly used methods is to chemically treat the copper surface, that is, black oxidation treatment, so that the copper surface forms a tiny rough shape. appearance, increase the specific surface area of ​​the copper surface, and at the same time, a layer of polar copper oxide is formed on the copper surface, which improves the bonding force between the copper surface and the prepreg (polymer material). However, copper oxide is prone to hydrolysis and dissolution when exposed to an acidic solution. Since it needs to be in contact with an acidic treatment agent in the subsequent production process, the oxide film on the copper surface wil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38
Inventor 李宏钦王植材叶绍明涂敬仁
Owner GUANGDONG TONESET SCI & TECH
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