Method for manufacturing semiconductor chip

Abstract

A semiconductor wafer (W) where circuits are formed in the area divided by streets is split into semiconductor chips having individual circuits. By interposing an adhesive sheet, whose adhesive force is lowered by stimulation, between the semiconductor wafer (W) and the support plate ( 13 ), the front side of the semiconductor wafer (W) is adhered to the support plate ( 13 ), thereby exposing the rear face ( 10 ) of the semiconductor wafer (W). The rear face ( 10 ) of the semiconductor wafer (W) with the support plate ( 13 ) is ground. After the grinding is finished, the semiconductor wafer (W) held with the rear face ( 10 ) up is diced into semiconductor chips (C). The adhesive sheet is given stimulus to lower the adhesive force and the semiconductor chips (C) are removed from the support plate ( 13 ). The semiconductor wafer and semiconductor chips are always supported by the support plate, avoiding damage and deformation.

Description

technical field [0001] The present invention relates to a method of manufacturing a semiconductor chip for preventing damage, deformation, etc. of the semiconductor wafer and the semiconductor chip during the process of grinding the back surface of the semiconductor wafer and then dicing to form the semiconductor chip. Background technique [0002] Such as Figure 14 As shown, the back surface of a semiconductor wafer W in which circuits are formed in a plurality of regions C divided by vias S is ground to a desired thickness, and then the vias S are cut vertically and horizontally to form semiconductor chips such as ICs and LSIs. [0003] When polishing the back surface, since the surface side is held by the polishing device, a protective tape is usually attached to the surface in order to protect the circuit formed on the surface. In addition, in order to realize the miniaturization and thinning of various electronic devices, when the thickness of the semiconductor wafer W...

AI Technical Summary

Problems solved by technology

[0004] However, when using a dicing device to cut a semiconductor wafer thinned by back grinding, the semiconductor wafer needs to be reattached to the dicing tape after the semiconductor wafer is peeled off from the support plate, so there is a risk of damaging the semiconductor wafer during peeling or pasting.

In particular, it is very difficult to reattach without damage to semiconductor wafers formed very thinly by grinding the thickness of 100 μm or less and 50 μm or less

[0005] In addition, for example, in the invention disclosed in Japanese Patent Application Laid-Open No. 10-284449, grinding and dicing are performed while the surface of the semiconductor wafer is attached to the holding tape, so it is not necessary to re-attach when transferring from grinding to dicing, but After dicing, when the semiconductor chip is peeled off from the dicing tape, there is a risk of damage, deformation, etc., such as cracking and chipping of the semiconductor chip

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