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Prepn of polyimide film for copper to be clad on

A technology of polyimide film and copper cladding, which is applied in the field of preparation of polyimide film for copper cladding, which can solve the problems that the performance cannot fully meet the needs of customers, and the thermal dimension of polyimide film is unstable.

Inactive Publication Date: 2004-11-24
SHANGHAI JINSHAN QIANFENG INSULATING MATERIAL
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Problems solved by technology

[0002] At present, with the rapid development of the electrical and electronic industries, the need for lightweight and high-density miniaturization of electrical and electronic machine components requires the development of corresponding high-performance insulating materials. This polyimide material has excellent properties. Heat resistance, cold resistance, chemical resistance and its good mechanical and electrical properties, so it is widely used in various fields such as electrical and electronic industries, especially polyimide for flexible printed circuit boards, which has developed rapidly in recent years Amine film has received special attention. It is widely used in various fields such as aerospace, computer OA machines, automobiles, clocks, communication equipment, cameras, and numerical control machine tools. However, the existing polyimide films are unstable in thermal dimensions and have various properties Can not fully meet the needs of customers

Method used

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  • Prepn of polyimide film for copper to be clad on

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Embodiment Construction

[0006] The present invention will be further described below in conjunction with the examples.

[0007] The invention mainly relates to a preparation method of a polyimide film for copper cladding. Dip-coating or casting at ~250℃ to form a polyamic acid film, which is then subjected to ring-closure imidization and cross-linking at a high temperature of 300-450℃ to form a polyimide film for copper cladding; Add 24 mol of dimethylacetamide solvent to the reaction kettle under stirring, after the diamine is dissolved, add 1 mol of dianhydride and stir to react for 30 minutes to 3 hours to form a viscous resin, and then add a double bond After 0.01-0.25 mol of the monomer of the molecular group is reacted for 30 minutes to 5 hours, the resin required by the present invention can be synthesized; Inner casting film formation, the film formation temperature is controlled within 50~250℃, the obtained partially imidized polyamic acid film is imidized at least at a temperature of 300~4...

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Abstract

The preparation process of polyimide film includes mixing diamine, maleic anhydride and dimethyl acetamide in certain molar ratio to form resin, dip coating or flow casting resin at 50-250 deg.c to form polyamide film, high temperature ring closing imidizing and cross-linking at 300-450 deg.c to form polyimide film for copper to be clad on. The polyimide film has heat stability of size, tin ironing resistance and flexibility except excellent characteristic of common polyimide film. It has double-bond component, such as maleic anhydride or maleimide, added for modification to reach the size stability.

Description

Technical field: [0001] The invention relates to the technical field of polyimide films, in particular to a preparation method of a copper-clad polyimide film suitable for flexible printed circuit boards. Background technique: [0002] At present, with the rapid development of the electrical and electronic industries, the need for lightweight, high-density and miniaturization of electrical and electronic machine components, the development of corresponding high-performance insulating materials needs to be solved urgently. This polyimide material has excellent properties. Heat resistance, cold resistance, chemical resistance and its good mechanical properties and electrical properties are widely used in various fields such as electrical and electronic industries, especially polyimide for flexible printed circuit boards that have developed rapidly in recent years. Amine films have received special attention. They are widely used in aerospace, computer OA machines, automobiles,...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L79/08
Inventor 屠强沈惠丽范建红
Owner SHANGHAI JINSHAN QIANFENG INSULATING MATERIAL
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