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Molding compound for sheet tantalum capacitor

A technology for tantalum capacitors and molding compounds, which is applied in the field of special plastic packaging materials for the electronic industry, can solve the problems that the development and production of domestic special-purpose chip tantalum capacitor molding compounds are still in their infancy, achieve high and low temperature characteristics, and meet the requirements of process parameters. , The effect of formula design is reasonable

Inactive Publication Date: 2004-11-17
WUXI RES & DESIGN INST OF CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is predicted that the market demand for chip tantalum capacitor molding compound in my country will reach more than 300 tons by 2005, while the research and production of domestic special chip tantalum capacitor molding compound is still in its infancy

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Mix 90kg of o-cresol epoxy resin and 10kg of brominated epoxy resin well, add 50kg of novolac resin, 1kg of dimethylimidazole, 2kg of carbon black, 2kg of carnaba wax, 400kg of fused silica powder, antimony trioxide 6kg, 4kg of silane coupling agent, 1kg of silicone rubber, through crushing, mixing, kneading, cooling, crushing, batch mixing, preforming, and packaging processes to prepare chip tantalum capacitor molding compound.

[0054] After testing, the spiral flow length is 70cm, the hot plate gelation time is 30s (160°C), the heat distortion temperature is 163°C, and the bending strength is 127MPa. Suitable for compression molding of chip tantalum capacitors requiring high strength.

Embodiment 2

[0056] Mix 85kg of o-cresol epoxy resin, 10kg of brominated epoxy resin, and 5kg of bisphenol A epoxy resin well, add 50kg of novolak resin, 1kg of dimethylimidazole, 6kg of iron yellow, 2kg of carnaba wax, melt Silicon micropowder 300kg, crystalline silica micropowder 100kg, antimony trioxide 6kg, silane coupling agent 4kg, silicone rubber 1kg, prepared into flakes through crushing, mixing, kneading, cooling, crushing, batch mixing, preforming and packaging processes Tantalum Capacitor Molding Compound.

[0057] After testing, the spiral flow length is 80cm, the hot plate gelation time is 33s (160°C), the heat distortion temperature is 155°C, and the bending strength is 120MPa. Suitable for compression molding of chip tantalum capacitors requiring high formability.

Embodiment 3

[0059] Mix 85kg of o-cresol epoxy resin, 10kg of brominated epoxy resin, and 5kg of cycloaliphatic epoxy resin, and add 50kg of novolak resin, 1kg of dimethylimidazole, 3kg of phthalocyanine blue, 2kg of carnaba wax, 300kg of fused silica powder, 100kg of spherical silica powder, 6kg of antimony trioxide, 4kg of silane coupling agent, and 1kg of silicone rubber, prepared into sheets by crushing, mixing, kneading, cooling, crushing, batch mixing, preforming, and packaging processes type tantalum capacitor molding compound.

[0060] After testing, the spiral flow length is 75cm, the hot plate gelation time is 28s (160°C), the heat distortion temperature is 176°C, and the bending strength is 118MPa. Suitable for compression molding of chip tantalum capacitors requiring high heat resistance.

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Abstract

The invention discloses a molded plastic compound for sheet tantalum capacitor, which is an epoxy resin compound and belongs to the field of special-purpose plastic encapsulating material in electronic industry. The molded plastic uses epoxy resin as the main block resin and phenolic resins as curing agent, prepared by adding solidification accelerating agent, filling material, releasing agent, combustion inhibitor, coloring agent, coupling agent, toughening agent and modifier though the steps of disintegrating, mixing, pugging, cooling down, disintegrating, batch mixing, pre-forming and packaging.

Description

technical field [0001] The invention relates to a molding compound for chip tantalum capacitors, which is an epoxy resin compound and belongs to the technical field of special plastic packaging materials for the electronic industry. Background technique [0002] It has become a trend to develop electronic components in the direction of chips. Chip tantalum capacitors have excellent performances such as small size, large capacity, wide application range, high reliability, high power, and low equivalent series resistance. Its application has developed from the initial military industry to the civilian industry. Expand to information industries such as small computers, mobile and portable communication tools. [0003] Chip tantalum capacitor molding compound is the key material for making chip tantalum capacitors. It is mainly used as a molded plastic casing. It is a special material with extremely high performance requirements and strong professionalism. Its quality will dire...

Claims

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Application Information

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IPC IPC(8): C08L63/00H01G2/10
Inventor 邓少文俞亚君姜建伟
Owner WUXI RES & DESIGN INST OF CHEM IND
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