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Hot curing solder resistant printing-ink composition

A technology of solder resist ink and composition, which is applied in the field of circuit board printing, can solve the problems of poor heat resistance, low adhesion, and low gloss, and achieve the effects of good heat resistance, firm adhesion, and high gloss

Inactive Publication Date: 2004-11-10
DAHUA GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the disadvantages of poor heat resistance, low adhesion, low gloss, and strong odor in existing heat-curing solder resist inks.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Embodiment 1 formula (mass %)

[0013] Thermosetting resin: bisphenol A epoxy resin 62

[0014] Thinner: Ethylene glycol butyl ether 4.5

[0015] Pigment: Phthalocyanine Green 1.5

[0016] Filler: Talc 12

[0017] Barium sulfate 15

[0018] Curing agent: imidazole 5

[0019] The above-mentioned components were mixed in proportion at room temperature, and after stirring evenly, they were ground on a three-roller machine to a green ink with a fineness of 10 μm and a viscosity of 4200 cps / 25°C. The obtained ink has good performance, and the printed circuit board produced has good heat resistance, firm adhesion, high gloss, and low odor. After being treated at a high temperature above 260°C, the ink coating does not change color, does not burst, and does not fall off.

Embodiment 2

[0020] Embodiment 2 formula (mass %)

[0021] Thermosetting Resin: Epoxy Novolac 63

[0022] Thinner: Diethylene glycol butyl ether 3.5

[0023] Pigment: Phthalocyanine Blue 1.5

[0024] Filler: Talc 12

[0025] Barium sulfate 15

[0026] Curing agent: imidazole 5

[0027] Mix the above components in proportion at room temperature, stir evenly, and grind on a three-roller machine to a blue ink with a fineness of 10 μm and a viscosity of 4000 cps / 25°C. The obtained ink has good performance, and the printed circuit board produced has good heat resistance, firm adhesion, high gloss, and low odor. After being treated at a high temperature above 260°C, the ink coating does not change color, does not burst, and does not fall off.

Embodiment 3

[0028] Embodiment 3 formula (mass %)

[0029] Thermosetting Resin: Epoxy Novolac 61

[0030] Thinner: Ethylene glycol butyl ether 5

[0031] Pigment: Carbon Black 2

[0032] Filler: Talc 12

[0033] Barium sulfate 15

[0034] Curing agent: imidazole 5

[0035] The above components were mixed in proportion at room temperature, and after stirring evenly, they were ground on a three-roll machine until the black ink with a fineness of 10 μm had a viscosity of 4600 cps / 25°C. The obtained ink has good performance, and the printed circuit board produced has good heat resistance, firm adhesion, high gloss, and low odor. After being treated at a high temperature above 260°C, the ink coating does not change color, does not burst, and does not fall off.

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PUM

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Abstract

The invention relates a hot-set solder resisting ink composition for production of printed circuit board which is prepared by combining some of heat hardening resin 30-70% (weight ratio), curing agent 2-8%, deflocculating agent 5-30% and filler 0-30%. The printed circuit board made from the hot-set solder resisting ink composition provided by the invention possesses good heat-proof quality, fast adherence, high degree of glossiness, and less odor.

Description

Technical field [0001] The invention relates to the technical field of circuit board printing, in particular to a thermosetting solder resist ink composition. Background technique [0002] With the rapid development of electronic products, the replacement of electrical products such as communications is also very fast. The development of these products has driven the development of the circuit board industry. The circuit board has changed from single-sided to double-sided, and even multi-layered. The product precision requirements are getting higher and higher. The materials for manufacturing circuit boards, especially the inks used for printed circuit boards, are more stringent. At present, the existing heat-curing solder resist inks on the market have problems such as poor heat resistance, low adhesion, low gloss, and strong odor to varying degrees. Contents of the invention [0003] The purpose of the present invention is to overcome the disadvantages of poor heat resi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/102
Inventor 刘欣余满春张升敏奚颖张立红
Owner DAHUA GROUP
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