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Grinding liquid composition

The technology of a composition and abrasive liquid is applied in the direction of polishing compositions containing abrasives, other chemical processes, chemical instruments and methods, etc., and can solve problems such as long processing time, uncertain micro-ripples, and impossibility to reduce micro-ripples, etc. Achieve the effect of increasing storage capacity and reducing tiny ripples

Inactive Publication Date: 2004-08-04
KAO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current situation is that it takes a long time to process abrasive particles, and in terms of mechanical conditions, it is impossible to reduce them to the required micro ripples.
In addition, a method of polishing using a polishing liquid composition containing a water-soluble iron compound has been studied (for example, refer to Patent Document 1), but the current situation is that even if this method is used, it is not certain that the micro waviness can be sufficiently reduced, and then the waviness can be reduced. and tumor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment I-1~I-7、 comparative example I-1~I-2

[0089] [Preparation Method of Polishing Liquid Composition]

[0090] ·Preparation method I-1

[0091] 16 parts by weight of abrasive material (α-alumina (alumina purity of 99.9%) with an average particle size of primary particles of 0.23 μm and an average particle size of secondary particles of 0.45 μm), 4 parts by weight of intermediate alumina (θ - Aluminum oxide with an average particle size of 0.2 μm and a specific surface area of ​​150m 2 / g, the alumina purity is 99.9%), 0.5 parts by weight of itaconic acid, 3 parts by weight of citric acid, the specified amount of micro-ripple reducer shown in Table 1, and the rest of the ingredients are ion-exchanged water, mixed and stirred to obtain 100 parts by weight of the polishing liquid composition. When grinding, the polishing liquid composition was diluted (Vol / Vol) with 4 times the amount of ion-exchanged water and used.

[0092] ·Preparation method I-2

[0093] 16 parts by weight of grinding material (the average partic...

Embodiment II-1~II-2、 comparative example II-1

[0119] [Polishing liquid composition preparation method II-1]

[0120] 16 parts by weight of abrasive material (α-alumina (purity: 99.9%) with an average particle size of primary particles of 0.23 μm and an average particle size of secondary particles of 0.8 μm), 4 parts by weight of intermediate alumina (θ-oxidized Aluminum, average particle size 0.2μm, specific surface area 150m 2 / g, the purity is 99.9%), 0.5 parts by weight of itaconic acid, 0.5 parts by weight of ammonium sulfate, 0.08 parts by weight of "Demol EP" (manufactured by Kao Co., Ltd.) as a surfactant, and the specified amount shown in Table 3 micro-ripple reducer, and the remaining components are ion-exchanged water, mixed and stirred to obtain 100 parts by weight of a polishing liquid composition. When polishing, the polishing liquid composition was diluted (Vol / Vol) with 4 times the amount of ion-exchanged water and used.

[0121] [grinding method]

[0122] Using a double-sided processing machine, the cen...

Embodiment II-3、 comparative example II-2

[0139] [Polishing liquid composition preparation method II-2]

[0140] 16 parts by weight of abrasive material (α-alumina (purity: 99.9%) with an average particle size of primary particles of 0.23 μm and an average particle size of secondary particles of 0.8 μm), 4 parts by weight of intermediate alumina (θ-alumina Aluminum, average particle size 0.2μm, specific surface area 150m 2 / g, the purity is 99.9%), 0.5 parts by weight of itaconic acid, the micro-ripple reducing agent shown in Table 4, and the remaining components are ion-exchanged water, mixed and stirred to obtain 100 parts by weight of the polishing liquid composition. Using the obtained polishing liquid composition, polishing was carried out in the same manner as in Example II-1. When polishing, the polishing liquid composition was diluted (Vol / Vol) with 4 times the amount of ion-exchanged water and used.

[0141] Table 4

[0142] The results are shown in Table 4. The value of each micro-waviness is shown as a ...

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PUM

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Abstract

The present invention provides: a micro-ripple reducing agent for grinding substrates for precision components composed of a surfactant with more than two ionic hydrophilic groups; composed of a surfactant with an OH group or a SH group with a total carbon number of 2 to 15 A micro-ripple reducing agent formed from a polycarboxylic acid compound or a salt thereof for polishing a substrate for precision components; a polishing fluid composition for polishing a substrate for precision components containing the micro-ripple reducing agent, an abrasive material and water; and containing water , a grinding liquid composition, an organic acid or a salt thereof, and a surfactant, wherein the organic acid is a polycarboxylic acid with a total carbon number of 2 to 15 having an OH group or an SH group, and the surfactant The molecule has more than two ionic hydrophilic groups and a molecular weight of more than 300; a method for reducing micro-ripples on a substrate for precision components; and a method for manufacturing a substrate for precision components.

Description

technical field [0001] The present invention relates to a fine waviness reducing agent for polishing a substrate for precision parts. More specifically, it relates to a polishing liquid composition containing the micro-waviness reducing agent, a method of reducing micro-waviness of a substrate for precision components using the polishing liquid composition, and a method of manufacturing a substrate using the polishing liquid composition. [0002] In addition, the present invention relates to a polishing composition capable of reducing waviness or nodules of a substrate to be polished. It further relates to a method of reducing waviness and / or nodules of a substrate to be polished using the polishing liquid composition, and a method of manufacturing a substrate using the above polishing liquid composition. technical background [0003] In order to reduce the minimum recording area and promote high capacity, hard disks are required to reduce the floating amount of the magneti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02C09K3/14
CPCC09G1/02C09K3/1463C09K3/1409
Inventor 北山博昭藤井滋夫
Owner KAO CORP
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