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Copper base alloy with improved punchin and impacting performance and its preparing method

A copper-based alloy, alloy technology, applied in 0}/I{, the preparation of the alloy, the copper-based alloy with stamping and punching properties, the SND is at least 10 [SND field

Inactive Publication Date: 2003-11-26
DOWA METALTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, none of these methods has fully addressed this issue

Method used

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  • Copper base alloy with improved punchin and impacting performance and its preparing method
  • Copper base alloy with improved punchin and impacting performance and its preparing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] In an argon atmosphere, copper-based alloy samples No. 1-4, No. 6-9 and No. 11-16 having the chemical composition analysis results (% by weight) shown in Table 1 were melted and cast in a vertical continuous casting machine An ingot with a size of 20mm×80mm×1000mm was formed. The obtained ingot was subjected to a homogenization heat treatment at 900° C. for 1 hour. Afterwards, the ingots (numbers 1-4, 6-9 and 11-16) were hot rolled from 20 mm to 6.0 mm in thickness, quenched with water and pickled. The 6.0mm thick sheets were cold rolled to various thicknesses: 2.5mm for samples numbered 1, 7 and 8; 2.0mm for samples numbered 2, 3 and 16; 2.0mm for samples numbered 4, 6 and 15 The thickness of the sample is 1.0mm; the thickness of the sample numbered 9 is 3.5mm; the thickness of the sample numbered 11 is 0.6mm; the thickness of the sample numbered 12 is 0.5mm; the thickness of the sample numbered 13 is 0.3mm; mm.

[0060] Copper-based alloy samples having the chemica...

Embodiment 2

[0068] For sample alloy No. 1 according to the present invention (see above Table 1; plate thickness 0.20mm), industrial phosphor bronze alloy (C5191; state, H; plate thickness, 0.20mm; 6.5% by weight Sn, 0.2% by weight P, the rest is Cu) and industrial copper-based alloy (C7025; state, H; plate thickness, 0.20mm; 3.2% by weight Ni, 0.70% by weight Si, 0.15% by weight Mg, and the rest is Cu) electrical conductivity, 0.2% yield strength, Spring deflection limit, Vickers hardness, press workability and bending properties were evaluated.

[0069] conductivity

(%IACS)

0.2% yield strength

(N / mm 2 )

0° direction

90° direction

elastic deflection limit

(N / mm 2 )

0° direction

90° direction

Vickers hardness

(HV)

Maximum punch

Number of times

(×10 4 )

R / t * the smallest

value

0° direction

90° direction

The present invention

Gold No. 1 sample

40...

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PUM

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Abstract

The present invention relates to a kind of copper-base alloy containing at least one element selected from Sn, Ni, P, Zn, Si, Fe, Co, Mg, Ti, Cr, Zr and Al in 0.01-30 wt% except Cu and impurities. The alloy has the X ray diffraction strength ratio SND of at least 10, where Snd=I{220} / I{200}, with I{220} is the X ray diffraction strength in {220} plane and I{200} is the X ray diffraction strength in {200} plane. At the same time, the alloy has balanced conductivity, strength, rebound elasticity, hardness and bending performance as well as improved punching performance. The present invention also relates to the preparation process of the alloy.

Description

Background of the invention [0001] The present invention relates to a copper-based alloy with improved stamping properties and a method for its preparation. More particularly, the present invention relates to copper based copper with improved stamping properties suitable for use in consumer products such as fine pitch information / communication connectors, semiconductor lead frames, and master plates for small switches and relays Alloy, and the preparation method of described alloy. [0002] As the assembly density of consumer electronics, information / communication equipment, and automotive components increases, connectors, switches, relays, etc. become smaller and smaller, requiring the use of thinner copper-based alloy sheets and thinner copper-based alloys in these devices. Thin copper-based alloy wires. [0003] The above parts are usually stamped on a high-speed stamping machine with a metal mold. During the pressing process, the material undergoes shear deformation und...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22F1/08
Inventor 畠山浩一菅原章
Owner DOWA METALTECH CO LTD
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