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Rareearth-silver solder and producing method thereof

A manufacturing method and technology of silver solder, applied in the direction of manufacturing tools, welding/cutting medium/material, welding medium, etc., can solve the problems that hinder the spreading and wetting of silver solder, the performance of silver-containing solder is not optimal, and the solder Fracture and other problems, to achieve the effect of good social and economic benefits, less defects, and improved process performance

Inactive Publication Date: 2003-08-13
金华市金钟焊接材料有限公司
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0002] At present, silver-containing solders such as silver-copper-zinc, silver-copper-zinc-tin, silver-copper-zinc-cadmium, silver-copper-phosphorus and other solders have been widely used in refrigeration, motors, electrical appliances, electronics, Instrumentation, shipbuilding, medical equipment, glasses, petrochemical and aviation industries, but the properties of these silver-containing solders are not ideal, especially because the existing silver solders contain lead (Pb), bismuth (Bi) They are not easy to form intermetallic compounds with silver, copper, zinc, phosphorus and other elemental compounds in silver solder, but exist in the form of solid solution, generally dissolved in silver or copper, when the silver solder is heated When the melting point of lead and bismuth is reached, lead and bismuth will be precipitated as elemental elements at the silver solid solution and copper solid solution grain boundaries of the silver solder, which will cause the solder to break during the drawing process of the silver solder; When the lead and bismuth are melted first, they are often at the front of the spreading of the solder, forming a "cofferdam effect", which hinders the spreading and wetting of the silver solder.

Method used

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Embodiment Construction

[0010] In a series of silver solders such as silver-copper-zinc, silver-copper-zinc-tin, silver-copper-zinc-cadmium, silver-copper-phosphorus solder, mixed rare earths mainly composed of cerium and lanthanum are added, The addition amount is 0.05% to 0.5%.

[0011] The production method of this kind of rare earth silver solder is: according to the prescribed formula, the mixed rare earth is added into the melting furnace in the form of mixed copper rare earth alloy for melting, and after melting, it is cast into an ingot, and it is used after peeling, sawing and pickling. It is extruded into wire by hot extrusion and stretched many times.

[0012] Concrete preparation method of the present invention is:

[0013] According to the prescribed formula, the ingredients are put into the medium frequency induction furnace for melting, and the rare earth elements in the ingredients are added into the furnace in the form of mixed copper rare earth alloy for melting (melting temperatur...

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Abstract

An RE-silver solder based on a silver solder series including Ag-Cu-Zn, Ag-Cu-Zn-Sn, Ag-Cu-Zn-Cd, and Ag-Cu-P is prepared through adding RE mixture whose main components are Ce and La, mixing, smelting, casting, sawing, acid washing, squeezing and drawing. Its advantages are high purity and plasticity, and good spreading nature on metal surface.

Description

1. Technical field [0001] The invention relates to a brazing material, in particular to a rare earth silver solder and a manufacturing method thereof. 2. Background technology [0002] At present, silver-containing solders such as silver-copper-zinc, silver-copper-zinc-tin, silver-copper-zinc-cadmium, silver-copper-phosphorus and other solders have been widely used in refrigeration, motors, electrical appliances, electronics, Instrumentation, shipbuilding, medical equipment, glasses, petrochemical and aviation industries, but the properties of these silver-containing solders are not ideal, especially because the existing silver solders contain lead (Pb), bismuth (Bi) They are not easy to form intermetallic compounds with silver, copper, zinc, phosphorus and other elemental compounds in silver solder, but exist in the form of solid solution, generally dissolved in silver or copper, when the silver solder is heated When the melting point of lead and bismuth is reached, lead a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/40
Inventor 戴修嘉徐跃祥庄确真白武
Owner 金华市金钟焊接材料有限公司
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