Chemical applying method and its applying device

Abstract

The invention provides a liquid medicine coating method and coating device. In order to eliminate the coating application unevenness which arises in a applied liquid medicine by disposing liquid stopping means capable of sufficiently stopping the liquid medicine spreading by flowing on a substrate when the liquid chemical is applied to the substrate of a large size, like a glass substrate for liquid crystals. Characterized in that, the flange part 1 includes conveyance rollers 5 for conveying the substrate 6, a dripping nozzle 7 for dripping the liquid medicine onto the substrate 6 under conveyance, a roller 10 (first liquid medicine stopping means) arranged closer to the upstream side position relative to the progressing direction of the substrate than position of the dripping nozzle 7; and an air knife 8 arranged closer to the upstream side position relative to the progressing direction than the roller 10 (total liquid medicine stopping means).

Description

technical field [0001] The present invention relates to a liquid medicine coating method and a coating device thereof. For example, when coating a liquid medicine on a glass substrate for liquid crystals, the method and the device can efficiently suppress the liquid medicine to uniformly adjust the spread of the medicine liquid, so that Uneven coating does not occur in the treated liquid. Background technique [0002] Next, a conventional chemical solution application device will be described with reference to the drawings. Figure 6 It is a schematic configuration diagram of a conventional chemical solution application device. Such as Figure 6 As shown, the existing liquid medicine coating device includes: a liquid medicine treatment tank 1, which coats the liquid medicine on a large-sized substrate 6 such as a glass substrate for liquid crystal; The substrate 6; the liquid medicine storage tank 2, which is arranged at the bottom of the liquid medicine treatment tank 1; t...

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Problems solved by technology

[0006] However, in the above-mentioned existing coating method, such as Figure 8 As shown in the explanatory diagram of , in order to make the air flow blown out from the air knife 8 uniform, it is necessary to strictly adjust the gap of the air blowing port 13

Adjustment is made with set screw 16 (shown in Figure 9 ), but if adjusted poorly, there will be a difference in clearance no matter where

Therefore, the blowing direction of the high-pressure air 12a, 12b, 12c blown out from the air blowing port 13 is scattered, and the flow of the high-pressure air is not concentrated. Even if the angle of the air knife 8 is adjusted, the dispersion cannot be eliminated.

[0007] Especially in the case of a large substrate such as a glass substrate for liquid crystal, it is difficult to uniformly disperse the chemical solution on the substrate, and it is difficult to uniformly apply the chemical solution dispersed in the direction perpendicular to the direction of travel of the substrate. As a result, as Figure 9 As shown in the top view of , only the air knife 8 cannot sufficiently prevent the flow and spread of the chemical solution 11 on the substrate 6, and uneven coating 15 occurs in the coated chemical solution 11, and after the coating of the substrate 6 is completed, remaining The substrate 6 affected by the coating unevenness 15 is transported to the next process

In the portion affected by the uneven coating 15, the coating thickness of the chemical solution is also uneven, which is likely to have an adverse effect on the next process.

[0008] Therefore, in the conventional chemical solution coating method and apparatus, only the air knife suppresses the chemical solution insufficiently to cause coating unevenness, and the substrate is conveyed while remaining affected by the coating unevenness. to the next process

For example, if the chemical solution application process is a cleaning solution application process, the influence of uneven application cannot be removed in the cleaning solution removal process of the next process, and it remains, which becomes the cause of poor cleaning.

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