Programmable non-volatile memory using ultra-thin medium breakdown phenomenon
A technology of reprogramming and memory cells, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve problems such as backwardness
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[0069] The present invention is a reprogrammable non-volatile memory cell and memory array. The non-volatile memory is composed of semiconductor memory cells. The data storage elements of the memory cells are fabricated around an ultra-thin medium such as a gate oxide layer for storing information. The method is to achieve breakdown by applying stress to the ultra-thin medium (soft breakdown or hard breakdown) builds up the leakage current level of the memory cell. The memory cell is read by sensing the current drawn by the cell. A suitable ultra-thin dielectric is, for example, a high-quality gate oxide layer with a thickness of 50 angstroms or less, which can be fabricated using advanced CMOS logic processes that are popular today. This oxide layer is typically formed by deposition, oxide growth of the silicon active region, or a combination of these two methods. Other suitable media include oxide-nitride-oxide composite media, compound oxide media, and the like.
[0070]...
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