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Filmforming method and device

A film-forming method and technology for a film-forming device, which can be applied to devices for applying liquid to surfaces, coatings, pre-treatment surfaces, etc., can solve problems such as spending a lot of time

Inactive Publication Date: 2002-05-01
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, until now, the liquid film formation process and the drying process have been performed independently, so it takes a lot of time until the final coating film is formed

Method used

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  • Filmforming method and device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0026] figure 1 It is a schematic diagram showing the schematic configuration of the film forming apparatus in the first embodiment of the present invention. figure 1 (a) is a plan view of the film forming apparatus, figure 1 (b) is a sectional view. The film forming apparatus can simultaneously perform a liquid film forming process and a drying process.

[0027] First, a structure for forming a liquid film in a film forming apparatus will be described. like figure 1 As shown in (a) and (b), the protective film dripping nozzle 102 and the nozzle moving mechanism (not shown in the figure) for moving the protective film dripping nozzle 102 in the y direction (the horizontal direction of the paper) and a diameter of 200 mm The substrate 110 to be processed is provided with a substrate to be processed, and a substrate to be processed moving stage (not shown in the figure) that moves the substrate to be processed 110 in the x direction is constituted.

[0028] Next, the struct...

no. 2 Embodiment approach

[0038] The device configuration of this embodiment is the same as that described in the first embodiment figure 1 The apparatus shown is the same, so the description of the apparatus is omitted. The drying process will be explained.

[0039] First, as in the first embodiment, a chemical solution is dropped onto the substrate 110 to be processed, and the formation of the liquid film 111 is started.

[0040]With the movement of the substrate to be processed 110, the suction port of the suction nozzle 101 connected to the vacuum pump 103 sucks the solvent atmosphere on the liquid film 111 on the substrate to be processed 110, and the first drying process is started.

[0041] Even after the suction nozzle 101 passes through the entire surface of the liquid film 111, from the +x side (coating start side) to the -x side (coating end side), a large amount of solvent remains in the liquid film 111, and the thickness of the liquid film 111 is 10μm( image 3 (a)).

[0042] As the se...

no. 3 Embodiment approach

[0047] The device configuration of this embodiment is the same as that described in the first embodiment figure 1 The apparatus shown is the same, so the description of the apparatus is omitted. The drying process will be explained.

[0048] First, as in the first embodiment, a chemical solution is dropped onto the substrate 110 to be processed, and the formation of the liquid film 111 is started. However, in the present embodiment, an interlayer insulating film (LKD21: manufactured by JSR) was sequentially dropped in a line shape (shape of a single stroke), and a liquid film 111 having a thickness of 40 μm was formed on the entire surface of the substrate.

[0049] Along with the movement of the substrate to be processed 110, the suction nozzle 101 connected to the vacuum pump 103 covers the substrate to be processed 110, and the solvent atmosphere on the liquid film 111 is sucked from the suction port, from the +x side (coating start side) The first drying process was star...

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Abstract

The invention provides a film forming method and device. A liquid film formation section is composed of a resist dropping nozzle 102, a nozzle movement mechanism not shown in a figure that moves the resist dropping nozzle 102 in a y direction (a horizontal direction on page space), and the movement rest of the substrate 110 to be treated not shown in the figure where the substrate 110 to be treated having a diameter of 200 mm is installed and is moved in an x direction. A liquid film drying section is composed of a suction nozzle 101, and a vacuum pump 103 connected to the suction nozzle 101. Also, the movement rest of the substrate to be treated is also one of the components of the liquid film drying section. The invention is able to suppress the generation of film thickness distribution in an application film, and at the same time to shorten time for forming the application film.

Description

technical field [0001] The present invention relates to a film-forming method and a film-forming device used in making a coating film in a semiconductor (single wafer process, a mask preparation process for exposure) and a liquid crystal equipment preparation technology. Background technique [0002] In the spin coating method that has been used in the lithography process, most of the liquid dripped on the substrate is discharged outside the substrate, and a few percent of the remaining liquid is used to form a film, and the used chemical liquid is wasted. There is a lot of liquid, which will also have a bad impact on the environment. In addition, on a square substrate or a large-diameter circular substrate with a diameter of 300 mm or more, turbulent flow occurs in the outer peripheral portion of the substrate, and a problem of uneven film thickness occurs in these portions. [0003] As a method for uniformly coating the entire surface of a substrate without wasting a chem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/16B05C5/02B05C11/10B05D3/00H01L21/027H01L21/20H01L21/30
Inventor 江间达彦伊藤信一
Owner KK TOSHIBA
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