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Display device packaging method

A technology for display devices and packaging methods, which is applied to electric solid-state devices, semiconductor devices, copying/marking methods, etc., can solve the problems of small black spots, uneven display, abnormal ink leveling, etc., and can solve the problem of uneven film thickness. , Improve the effect of mura defect

Pending Publication Date: 2021-11-23
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Abstract
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  • Application Information

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Problems solved by technology

However, on the one hand, the gas (outgas) in the ink easily enters the OLED device through the crack (pinhole) of the first inorganic layer, causing small black spots to appear on the display screen when the OLED device is displayed; Abnormal leveling, resulting in uneven film thickness of the formed organic layer, resulting in uneven display (mura) defects

Method used

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Embodiment Construction

[0024] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present invention, but not to limit the scope of the present invention. Likewise, the following embodiments are only some but not all of the embodiments of the present invention, and all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] In addition, the directional terms mentioned in the present invention, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., only is the direction of reference to the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the various figures, structurally similar elements are denoted by the ...

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Abstract

The invention provides a display device packaging method, which comprises the following steps: providing a display device on which a first inorganic layer covering the display device is formed; printing ink on the first inorganic layer by inkjet printing; heating the ink; irradiating the ink by the ultraviolet light to cure the ink, forming an organic layer on the first inorganic layer, and heating the ink before being cured, so that the ink is quickly leveled, the problem of non-uniform film thickness of the organic layer formed by the ink is solved, and the mura defect is improved.

Description

【Technical field】 [0001] The invention relates to the field of display technology, in particular to a display device packaging method. 【Background technique】 [0002] Organic electroluminescent displays (Organic Light Emitting Diode, OLE D) have the advantages of simple structure, self-luminescence, fast response, ultra-thin, low power consumption, etc., and have been vigorously developed. Since the cathode (Cathode) and the light-emitting layer (EML) of the OLED device are easily mixed with the water (H 2 O) Oxygen (O 2 ) reacts, which greatly affects the service life and display effect of the OLED device, and it is necessary to isolate the water and oxygen by encapsulating the OLED device. At present, the mainstream packaging methods include thin film packaging (TFE), glass frit packaging, wall packaging, and surface adhesive packaging. Since thin film encapsulation can be applied to windable display technology (ie, flexible display technology), it is widely used in OLE...

Claims

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Application Information

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IPC IPC(8): B41M5/00B41M7/00H01L51/56
CPCB41M5/0047B41M7/0054H10K71/00
Inventor 倪奎
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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