Method for mfg. microstructure resonance beam pressure sensor using SiNx as beam

Abstract

A process for preparing the pressure sensor using SiNx as micro resonant beam includes depositing SiN film on polished silicon substrate, depositing sacrificial layer, etching, depositing SiNx film, preparing vibration exciting and picking up resistors, preparing metal leading wires, etching beam slot, preparing resonant beam, etching low-stress nitrogen silicide film on the back of Si substrate to form corrosion windows, corrosion, preparing pressure-sensitive film, corrosiding out sacrificial layer, releasing SiNx beam, welding leading wire and vacuum packaging.

Description

technical field [0001] The present invention relates to the manufacture method of miniature pressure sensor, particularly relate to SiN x Fabrication method for a novel microstructure resonant beam pressure sensor for the beam. Background technique [0002] So far, the microstructure resonant beam pressure sensor made by MENS technology is mainly made of single crystal silicon and polycrystalline silicon materials. The silicon resonant beam pressure sensor is mainly used for high-precision pressure measurement. Because it has a frequency output, it is easy to carry out digital processing; because it is manufactured with microelectronic technology, it is easy to achieve miniaturization, integration, and low-cost mass production. [0003] A common silicon microstructure resonant beam pressure sensor includes three parts: a resonant beam pressure sensor chip (1), a tube cap (3), and a tube seat (4). The silicon microstructure resonant beam pressure sensor chip is connected to...

AI Technical Summary

Problems solved by technology

[0005] 1) The manufacturing process of the beam is complicated, the process requirements are very strict, and it is difficult to control the required dimensional accuracy, which affects the yield of the device and makes the cost of the device very high

Although it can be improved by self-stop corrosion and other methods, these methods either reduce device performance or increase expensive equipment, thereby increasing costs.

Increasing the process steps itself also increases the complexity of the process, and the cost of the process increases significantly

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