Device for measuring bending of saw wire of wire saw machine tool

Abstract

The invention belongs to the field of semiconductor hard and brittle material cutting, and particularly relates to a device for measuring saw wire bending of a fret saw machine tool, which comprises a device body, the device body comprises a bracket, a bottom plate is movably arranged at the bottom of the bracket, oppositely-opened shading plates are slidably arranged on the front and rear walls of the bracket, and a light source for illumination is arranged on one side wall of the bracket. One side wall of the support is provided with a plurality of light sources, the other side wall of the support is correspondingly provided with a plurality of sensors for sensing the light sources, and the side wall of the support is further provided with a signal processing box electrically connected with the plurality of sensors. The signal processing box sends a signal indicating that the feeding speed needs to be reduced when the bending is too large to the control center of the machine tool through judgment, and the control center of the machine tool sends an instruction for reducing the rotating speed of a motor to a feeding motor of the machine tool through identification judgment, so that the feeding speed is reduced, the sawing wire bending is reduced, and the wire cannot be broken; the cutting efficiency is improved, and the device is suitable for wide popularization.

Description

technical field [0001] The invention belongs to the field of semiconductor hard and brittle material cutting, and in particular relates to a device for measuring the bending of saw wires for a wire saw machine tool. Background technique [0002] Semiconductor hard and brittle materials are more and more widely used in various fields. For example, single crystal silicon is an important raw material for the manufacture of semiconductor materials, but due to the special properties of its own materials - high hardness, high brittleness and poor conductivity The processing of the material is difficult. Wire saw cutting technology is a processing technology suitable for the processing of hard and brittle materials. According to the type of saw wire, it is mainly divided into fixed abrasive wire saw machine and free abrasive wire saw machine. According to the number of saw wires, it is divided into single wire cutting and multi-wire cutting. , In the process of saw wire cutting ma...

AI Technical Summary

Problems solved by technology

At this stage, due to the different performances of different wire saw machine tools, the performances of different wires, and the processing difficulties of different materials, there is no set of empirical parameters to guide processing, and it is difficult to determine how much feed should be selected when cutting a certain material. Speed, if the feed speed is too small, it will affect the processing efficiency, if the feed speed is too high, it will easily cause the wire to break, and with the change of the shape of the workpiece where the wire is cut, the resistance to the wire is also different, and the existing machine tools are usually The feed speed is set in advance according to experience, and the appropriate feed speed cannot be determined according to the actual processing conditions.

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