Embedded structure and manufacturing method of filter module

Abstract

According to the embedded structure of the filter module, full device packaging in the filter module is changed into partial packaging and partial substrate embedding, so that the conflict problem of full filling of a filter cavity covering film and a copper column gap of a flip switch chip is solved, and the problem of gap filling between two poles of an inductance passive element is solved; the problem of reliability hidden danger caused by extremely reduced size of a filter packaging body is solved, the hidden danger of product deformation and failure caused by unbalanced internal stress of various different materials in full-device packaging is solved, and the problems of dense components, small gaps and insufficient epoxy resin filling are solved. Meanwhile, different packaging schemes of the filter can be selected, so that the cost control of a scheme using a high-cost special film coating material can be effectively reduced.

Description

technical field [0001] The present invention relates to the technical field of semiconductor radio frequency, in particular to a signal receiving end filter module integrated device. Background technique [0002] Current package structure: [0003] The first type: PiP (Package in Package) module device encapsulates filter plastic encapsulated device [0004] The common shape is LGA (Land Grid Array) grid array package. The internal plane structure is to mount all components on the substrate (component carrier). The arrangement components include: multiple filter packages, a flip-chip switch chip, Multiple inductive passive components, etc. The filter package and the module substrate are connected with tin solder, and the gaps of the components are filled with epoxy resin, which plays the role of circuit isolation and protection. [0005] The common structure of the filter package is that a filter chip is flipped on the substrate, and a layer of isolation film is pasted on...

AI Technical Summary

Problems solved by technology

[0014] In order to solve the existing problems in the existing technology, this solution changes the package of all devices in the filter module to a partial package and a part of the substrate embedded, which solves the problem of fully filling the gap between the filter cavity film and the copper pillar of the flip-chip switch chip. The conflict problem solves the problem of filling the gap between the two poles of the inductive passive component, solves the hidden danger of reliability caused by the extremely small size of the filter package, and solves the hidden danger of product deformation and failure caused by the unbalanced internal stress of various materials in the package of the whole device. Solved the problem of insufficient filling of epoxy resin in dense gaps of components

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