Doubling detection method, doubling detection optical device and doubling detection system

Abstract

The invention relates to a doubling detection method, a doubling detection optical device and a doubling detection system. The invention discloses a doubling detection method, which comprises the following steps of: placing a light-transmitting part with total reflection light inside on one side of a wire net formed by a plurality of cutting wires; moving the light transmitting piece until the light transmitting piece is in contact with the wire net; the wire net enables the surface of the light-transmitting piece to generate a suppressed total reflection phenomenon, and the surface of the light-transmitting piece has light and shade changes; narrowing the observation range to a brightness increasing area on the surface of the light-transmitting part; and searching a doubling position of the wire net in the brightness increasing area. According to the doubling detection method, due to the fact that the total reflection phenomenon occurs in the light-transmitting part and the multiple cutting lines of the wire net can generate different pressures and different contact areas on the surface of the light-transmitting part, the inhibited total reflection phenomenon is generated on the surface of the light-transmitting part, the brightness changes, the doubling position of the wire net is found in the brightness increasing area, and the doubling detection accuracy is improved. The inspection range of doubling inspection is effectively reduced, and the speed and efficiency of doubling inspection are improved.

Description

technical field [0001] The invention relates to the technical field of auxiliary detection of wafer manufacturing, in particular to a parallel detection method, a parallel detection optical device and a parallel detection system. Background technique [0002] In the production of wafers, the most commonly used dicing device is a dicing machine with a dicing wire web. The main cutting method is to place a crystal rod on a cutting wire mesh composed of micron-scale diamond wires or mortar wires evenly arranged between two drive rollers, so as to realize the process of cutting the crystal rod into wafers. The length of the cutting lines in the cutting line network varies from about several hundred millimeters, and the diameter of the lines ranges from tens to hundreds of microns. The interval between them is determined by the thickness of the wafer to be cut, usually tens to hundreds of microns. . Therefore, the cutting wire mesh has the characteristics of a large number of c...

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a parallel detection method, a parallel detection optical device and a parallel detection system in view of the problem that the traditional technology usually uses a one-by-one inspection method to check whether there is a parallel in the line network, resulting in low troubleshooting efficiency.

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