Heating device for chip mounting process

Abstract

The invention relates to a heating device for a chip mounting process, which comprises a horizontally arranged bottom plate, the bottom plate is provided with a heating system and a through hole, the through hole is parallel to the front-back direction, the front end of the through hole is provided with a joint, the rear end of the through hole is provided with a sealing block in a sealing manner, the top of the bottom plate is provided with a plurality of suction holes, and the suction holes are communicated with the through hole. The multiple suction holes are formed between the sealing block and the connector in a front-back mode, the axes of the suction holes are vertically arranged, the suction holes communicate with the through hole, and a cleaning mechanism and a dredging mechanism are arranged on the bottom plate. According to the heating device for the chip mounting process, the function of removing impurities is achieved, the influence of the impurities on the adsorption effect of the substrate is prevented, the function of automatically dredging the suction holes is achieved in the impurity removing process, the convenience of maintenance of the suction holes is improved, in addition, the suction holes are synchronously dredged in the impurity removing process, the impurities can be prevented from falling into the suction holes, and the service life of the substrate is prolonged. And the impurity removal effect is improved.

Description

technical field [0001] The invention relates to a heating device used in a chip loading process, and belongs to the technical field of sensor production. Background technique [0002] A sensor is a detection device that can sense the measured information, and can transform the sensed information into electrical signals or other required forms of information output according to certain rules, so as to meet the requirements of information transmission, processing, storage and display. , recording and control requirements. The characteristics of sensors include: miniaturization, digitization, intelligence, multi-function, systematization, and networking. It is the first link to realize automatic detection and automatic control. The existence and development of sensors allows objects to have senses such as touch, taste, and smell, and makes objects slowly become alive. It is usually divided into ten categories according to its basic sensing functions, including thermal elemen...

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Problems solved by technology

[0004] During the use of the existing heating plate, in order to prevent the substrate from warping and affect the loading effect, a vacuum suction hole will be set on the heating plate, and the substrate will be adsorbed through the vacuum suction hole to make the substrate close to the heating plate. After use, there will be more impurities in the suction hole. The impurities will not only affect the adsorption effect of the substrate, but also easily block the suction hole. The impurities in the suction hole need to be cleaned regularly, and the maintenance is difficult due to the small diameter of the suction hole. Therefore, , there is a need for a heating device for the film loading process to realize automatic cleaning of impurities and improve the convenience of maintenance of the suction hole

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