Multi-chip package with antenna structure and preparation method thereof
A technology of multi-chip packaging and antenna structure, applied in the direction of antenna, antenna coupling, antenna components, etc., can solve the problems of signal interference, peeling and falling off, unstable antenna structure, etc., to ensure stable function, improve bonding tightness, Avoid peeling effect
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[0025] In order to better understand the technical solutions of the present invention, the embodiments of the present invention are described in detail below with reference to the accompanying drawings. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0026] The present invention provides a method for preparing a multi-chip package with an antenna structure, which includes the following steps:
[0027] A first temporary substrate is provided, followed by forming a peelable adhesive layer on the first temporary substrate.
[0028] A first inorganic sacrificial material layer is formed on the peelable adhesive layer, then a first flexible encapsulation layer is formed on the first inorganic sacrificial material layer, and a first antenna structure is formed in the first flexible encapsulation layer and the second ante...
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