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Micro-LED micro display chip and manufacturing method thereof

A technology of micro-display chip and manufacturing method, which is applied in the field of micro-display, can solve the problems of high positioning accuracy and small size of Micro-LED, and achieve the effect of good flatness, small fluctuation and easy process

Pending Publication Date: 2022-05-13
RAYSOLVE OPTOELECTRONICS (SUZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the small size of Micro-LEDs and high positioning accuracy requirements, how to transfer Micro-LED chips to circuit substrates in batches with high efficiency and high yield has become a technical bottleneck that urgently needs breakthroughs in the application of Micro-LEDs to the field of micro-display technology.

Method used

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  • Micro-LED micro display chip and manufacturing method thereof
  • Micro-LED micro display chip and manufacturing method thereof
  • Micro-LED micro display chip and manufacturing method thereof

Examples

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Embodiment 1

[0062] Figure 1a , Figure 1b It shows a top view of an illustrative Micro-LED microdisplay chip according to some implementations in the embodiments of the present invention, Figure 2a show Figure 1a A cross-sectional view of an illustrative Micro-LED microdisplay chip along the line A-A, Figure 2b show Figure 1a A cross-sectional view of an illustrative Micro-LED microdisplay chip along line B-B.

[0063] see Figure 1a and Figure 2a , a Micro-LED micro-display chip, obtained by monolithic integration / wafer-level manufacturing process and cutting, the Micro-LED micro-display chip includes a first substrate 110 and a substrate formed on the first substrate 110 LED semiconductor layer, the first substrate 110 includes a driving circuit and a plurality of contacts 111 electrically connected to the driving circuit, the LED semiconductor layer is fixedly bonded on the first substrate 110 through a bonding layer 160, and the The LED semiconductor layer is divided into a p...

Embodiment 2

[0112] Figure 2c It shows a cross-sectional view of an illustrative Micro-LED microdisplay chip in a specific implementation manner in the embodiment of the present invention. A Micro-LED microdisplay chip includes a first substrate 110 and a substrate formed on the first substrate. LED semiconductor layer on 110, the first substrate 110 includes a driving circuit and a plurality of contacts 111 electrically connected to the driving circuit, the LED semiconductor layer is fixedly bonded on the first substrate 110 through a bonding layer 160, And the LED semiconductor layer is divided into a plurality of LED units 100 arranged in an array, each contact 111 drives one of the LED units 100 , and adjacent LED units 100 can be driven independently.

[0113] In this embodiment, the bonding layer 160 includes a plurality of bonding metal pads 161, the bonding metal pads 161 and the bonding layer (the bonding layer here is actually the main part of the bonding layer) Between 160 the...

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Abstract

The invention discloses a Micro-LED micro display chip and a manufacturing method of the Micro-LED micro display chip. The Micro-LED micro display chip comprises a substrate, a plurality of LED chips and a plurality of LED chips, the plurality of LED units are arranged in an array and are arranged on the substrate, and the adjacent LED units can be independently driven; the plurality of bonding metal pads are arranged on the substrate; wherein the substrate comprises a driving circuit, the driving circuit is provided with a plurality of contacts, and each contact is electrically connected with the LED unit through a bonding metal pad. According to the Micro-LED micro display chip provided by the embodiment of the invention, the depth of the etching hole is shallower, the exposure and passivation layer hole opening process is easier to control, the flatness of the subsequently formed electrode layer is better, and the fluctuation of the electrode layer at the corresponding contact is smaller.

Description

technical field [0001] The invention particularly relates to a Micro-LED micro-display chip and a manufacturing method thereof, belonging to the technical field of micro-display. Background technique [0002] In recent years, LEDs have become popular in lighting applications. As a light source, LEDs have many advantages, including higher light efficiency, lower energy consumption, longer lifetime, smaller size, and faster switching speed. [0003] Displays with tiny sized LEDs are called micro-LEDs. Micro LED displays have an array of tiny LEDs forming a single pixel element. A pixel is a tiny illuminated area on a display screen, and many pixels can make up an image. In other words, pixels can be the small discrete elements that together make up an image on a display. Pixels are usually arranged in a two-dimensional (2D) matrix and represented using dots, squares, rectangles, or other shapes. A pixel can be the basic unit of a display or a digital image and has geometr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L27/15H01L33/00
CPCH01L33/62H01L27/156H01L33/005H01L2933/0066
Inventor 庄永漳
Owner RAYSOLVE OPTOELECTRONICS (SUZHOU) CO LTD
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