Miniaturized high-reliability external modulation light source packaging structure and packaging method

Abstract

The invention provides a miniaturized high-reliability external modulation light source packaging structure and a packaging method. The miniaturized high-reliability external modulation light source packaging structure comprises a packaging shell, a ceramic circuit board, an optical coupling system, an optical base and a thermoelectric refrigerating unit, the packaging shell comprises a shell wall body, densely-arranged glass terminals and a bottom heat dissipation disc; the optical coupling system comprises an aspherical lens, an isolation lens and a metalized inclined plane optical fiber assembly which are arranged in sequence; the shell wall body and the bottom heat dissipation disc are matched to form a packaging cavity; the ceramic circuit board, the optical coupling system, the optical base and the thermoelectric refrigerating unit are arranged in the packaging cavity; the densely-arranged glass terminal is sintered in one end face of the shell wall body; the ceramic circuit board, the optical base and the thermoelectric refrigerating unit are stacked and welded; and the thermoelectric refrigerating unit is welded on the bottom heat dissipation disc. Compared with the prior art, the invention has the advantages of small structural size, small system thermal resistance and high product reliability.

Description

technical field [0001] The invention relates to the technical field of packaging of optical communication devices, in particular to a packaging structure and packaging method for a miniaturized and highly reliable externally modulated light source. Background technique [0002] The externally modulated light source mainly produces laser with constant wavelength and constant intensity, which provides high-power stable optical signals for the external modulator, and finally realizes the electro-optic conversion function. It is the core device of the microwave optical transmission system and is widely used in various fields of military and civilian, including radar communication. , electronic countermeasures and other national defense fields. The packaging design of the externally modulated light source is mainly to reliably assemble the high-power semiconductor laser chip, ceramic circuit board, optical coupling system, and temperature control system in a closed package to rea...

AI Technical Summary

Problems solved by technology

[0004] (1) Large volume and weight: The packaging structure adopts the form of soldering pins drawn out from both sides, and the flat soldering pins are drawn out from both sides, and the interconnection with the inner side goes deep into the package through the inner ceramic wiring, and the ceramic occupies a relatively small area inside the module. Large space, resulting in large module size;

[0005] (2) Inconvenient installation and low reliability: the mounting ear of the packaging structure is located at the bottom of the device, and a thicker mounting plate is required to ensure the size of the hole. In addition, the material of the mounting ear is integrated with the chassis (usually WCu alloy), and the material is brittle. The fixing ear is easy to break during installation;

[0006] (3) The reliability of pin assembly is not high: the lead wires and mounting boards of the current packaging structure are mostly surface-mounted. When there is stress in the horizontal direction, it is easy to generate stress concentration at the solder joint, which affects the long-term reliability of the solder joint.

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